The time evolution of electrical and thermodynamic characteristics of surface dielectric barrier discharge caused by dielectric degradation

The degradation of the dielectric layer is a common issue in dielectric barrier discharge (DBD). The performance of DBD devices may suffer from instability due to potential corrosion of the dielectric layer caused by discharge, which could even result in structural failure. To gain a comprehensive understanding of the degradation of DBD devices during discharge, the evolution of the performance of DBD devices with various dielectric materials over time is studied. Periodic patterns are found to form on the dielectric surface along the edge of the high-voltage electrode. The electrical data, emission spectra, and surface morphologies of DBD devices with three different dielectric materials, namely ceramics, glass, and PCB, are obtained during an eight-hour discharge. The electrical and thermodynamic characteristics of DBD devices with the three dielectric materials are found to initially decrease by about 20~40%. Subsequently, they remain stable in devices with ceramics and PCB dielectric layers but increase in devices with glass dielectric layers until the end. Surface morphologies reveal that periodic patterns consisting of metal accumulations, etching pits, and metal depositions form on the surfaces of ceramics, glass, and PCBs, respectively. Some organic compounds vaporize from the surface of PCBs. The deposition, etching, and vaporization could be reasons for changes in the electrical and thermodynamic characteristics. It shows that degradation occurs not only in organic dielectrics like polymers but also in inorganic dielectrics such as ceramics and glass. To enhance stability and prevent potential failures and overestimations, electrical and optical measurements could be utilized as diagnostic methods in applications involving DBD devices.