Solid-mechanics analysis and modeling of the alloyed ohmic contact proximity in GaN HEMTs using µRaman spectroscopy

This study explores the impact of alloyed ohmic contact separation on ungated GaN high electron mobility transistors (HEMTs) lattice stress by employing Raman spectroscopy and solid mechanics simulations for comprehensive analysis. Focusing on the substantial stresses exerted by ohmic contacts, our research introduces a novel mechanical calibration procedure. The proposed procedure demonstrates that the stress in the GaN buffer can be precisely modelled using Raman measurements taken from patterns of varying length, which in return reveals the impact of ohmic contacts on stress. We show that this technique shows a good alignment to the Raman measurement results. Moreover, we identify ohmic contact edges as potential sites for defect generation due to the accumulation of substantial elastic energy, a finding supported by experimental observations of crack formations in related studies. Our calibrated mechanical model not only enhances the understanding of stress distributions within GaN HEMTs but also lays the groundwork for future improvements in electro-thermo-mechanical simulations.