Joonha Lee, H. Park, Junsu Kim, Won-Seon Seo, Sang-Il Kim, Hyun-Sik Kim
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We investigate how electronic band parameters (effective mass, non-degenerate mobility, weighted mobility, and <i>B</i>-factor) evolve with increasing Cu content (<i>x</i>). Additionally, the influence of electric current pulse (ECP) treatment is examined. Experimentally, the <i>zT</i> of <i>x</i> = 0.001 was higher than <i>x</i> = 0.0025 samples near room temperature. However, the SPB model predicts that due the higher <i>B</i>-factor of the <i>x</i> = 0.0025 sample, its theoretical maximum <i>zT</i> can be as high as ~1.48 at 350 K. Based on literature data on thermoelectric transport properties in the <i>x</i> = 0.001 sample after the ECP treatment, the impact of the ECP treatment on the electronic band parameters and the lattice thermal conductivity of the <i>x</i> = 0.0025 sample is estimated. ECP treatment slightly reduces electrical performance below 350 K, but it significantly suppresses the lattice thermal conductivity, ultimately leading to an enhanced <i>zT</i>. The predicted maximum <i>zT</i> reaches ~1.54 at 300 K.","PeriodicalId":17894,"journal":{"name":"Korean Journal of Metals and Materials","volume":null,"pages":null},"PeriodicalIF":1.1000,"publicationDate":"2024-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Theoretical Maximum Thermoelectric Performance of Cu-doped and Electric Current Pulse-treated Bi-Sb-Te Alloys\",\"authors\":\"Joonha Lee, H. Park, Junsu Kim, Won-Seon Seo, Sang-Il Kim, Hyun-Sik Kim\",\"doi\":\"10.3365/kjmm.2024.62.7.550\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Bi<sub>2</sub>Te<sub>3</sub> shows high thermoelectric performance near room temperature, making it the most widely used material in thermoelectric cooling applications. Cu doping has been found to be effective in improving the thermoelectric performance of Bi<sub>2</sub>Te<sub>3</sub>. 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引用次数: 0
摘要
Bi2Te3 在室温附近具有很高的热电性能,因此成为热电冷却应用中使用最广泛的材料。研究发现,掺杂铜可有效提高 Bi2Te3 的热电性能。然而,由于铜离子易迁移的问题,掺铜 Bi2Te3 的稳定性一直是个问题,因此值得探讨。本研究利用单抛物带 (SPB) 模型分析了 CuxBi0.3Sb1.7-xTe3 的电子传输特性。我们研究了电子能带参数(有效质量、非退化迁移率、加权迁移率和 B 因子)如何随着铜含量(x)的增加而演变。此外,我们还研究了电流脉冲(ECP)处理的影响。实验结果表明,x = 0.001 的 zT 高于接近室温的 x = 0.0025 样品。然而,根据 SPB 模型预测,由于 x = 0.0025 样品的 B 因子较高,其理论最大 zT 值在 350 K 时可高达 ~1.48。根据 ECP 处理后 x = 0.001 样品的热电传输特性的文献数据,估算了 ECP 处理对 x = 0.0025 样品的电子带参数和晶格热导率的影响。ECP 处理会略微降低 350 K 以下的电性能,但会显著抑制晶格热导率,最终导致 zT 增强。预测的最大 zT 在 300 K 时达到 ~1.54。
Theoretical Maximum Thermoelectric Performance of Cu-doped and Electric Current Pulse-treated Bi-Sb-Te Alloys
Bi2Te3 shows high thermoelectric performance near room temperature, making it the most widely used material in thermoelectric cooling applications. Cu doping has been found to be effective in improving the thermoelectric performance of Bi2Te3. However, due to the problem of easy migration of Cu ions, the stability of Cu-doped Bi2Te3 is always an issue, and therefore worth exploring. This study utilizes the Single Parabolic Band (SPB) model to analyze the electronic transport properties of CuxBi0.3Sb1.7-xTe3. We investigate how electronic band parameters (effective mass, non-degenerate mobility, weighted mobility, and B-factor) evolve with increasing Cu content (x). Additionally, the influence of electric current pulse (ECP) treatment is examined. Experimentally, the zT of x = 0.001 was higher than x = 0.0025 samples near room temperature. However, the SPB model predicts that due the higher B-factor of the x = 0.0025 sample, its theoretical maximum zT can be as high as ~1.48 at 350 K. Based on literature data on thermoelectric transport properties in the x = 0.001 sample after the ECP treatment, the impact of the ECP treatment on the electronic band parameters and the lattice thermal conductivity of the x = 0.0025 sample is estimated. ECP treatment slightly reduces electrical performance below 350 K, but it significantly suppresses the lattice thermal conductivity, ultimately leading to an enhanced zT. The predicted maximum zT reaches ~1.54 at 300 K.
期刊介绍:
The Korean Journal of Metals and Materials is a representative Korean-language journal of the Korean Institute of Metals and Materials (KIM); it publishes domestic and foreign academic papers related to metals and materials, in abroad range of fields from metals and materials to nano-materials, biomaterials, functional materials, energy materials, and new materials, and its official ISO designation is Korean J. Met. Mater.