确定用 Czochralski 法沿晶体学方向 [111] 生长并掺杂碲的 InSb 单晶中形成的蚀刻坑的形态分类标准

N. Y. Komarovsky, E. O. Zhuravlev, E. V. Molodtsova, A. V. Kudrya, R. Kozlov, A. G. Belov, S. S. Kormilitsina
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引用次数: 0

摘要

选择性蚀刻法信息量大,耗费人力少,可用于评估生产条件下单晶体的结构缺陷(位错密度)。然而,对所获数据的解释可能会因监管文件类型的选择而有所不同。我们介绍了利用数字图像处理确定蚀刻坑形态分类标准的结果。我们分析了通过 Czochralski 方法生长并掺杂碲的 InSb (111) 单晶体。通过顺序选择性蚀刻法发现,铟硒化铋(111)表面的岛状凹坑,无论其大小如何,都极有可能是位错。反过来,在反复蚀刻过程中消失的 "规则 "形状的凹坑群,很可能产生于表面出现点缺陷的地方,与 Lomer-Cottrell 势垒或其他位错群的形成无关。在亮度场分析的基础上,提出了通过确定平均像素强度值来区分蚀刻坑的标准。所获得的结果可用于制造矩阵和线性光电探测器的结构,以及通过 Czochralski 方法优化单晶生长的工艺参数。
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Determination of the criterion for the morphological classification of etching pits formed in InSb single crystals grown by the Czochralski method in the crystallographic direction [111] and doped with tellurium
The method of selective etching is used to assess the structural imperfection (dislocation density) of single crystals in production conditions due to high informativity and rather low labor consumption. However, the interpretation of the data obtained may differ depending on the choice of the type of regulatory documentation. We present the results of determining the criterion of morphological classification of etch pits using digital image processing. InSb (111) single crystals grown by the Czochralski method and doped with tellurium were analyzed. It was found by the method of sequential selective etching that the island-shaped pits on the surface of InSb (111), are highly likely to be dislocation in nature, regardless of their size. In turn, the clusters of pits of «regular» shape, disappearing in the course of repeated etching, probably arise in the places where point defects come to the surface and are not associated with the formation of Lomer-Cottrell barriers or other dislocation clusters. A criterion for differentiation of etching pits by determining the value of the average pixel intensity is proposed on the basis of brightness field analysis. The results obtained can be used in manufacturing structures for matrix and linear photodetectors, as well as in optimizing process parameters of the single crystal growth by the Czochralski method.
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