Syed Asghar Husain Rizvi, Rohit Sahu, Ravi Butola, Manish Saraswat, Ajay Sharma, Harpreet S. Bhatia
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引用次数: 0
摘要
这项调查旨在估算电火花加工时工件中产生的残余应力。产品加工后产生的残余应力可能会导致产品寿命降低和在使用过程中出现故障。AISI 4340 适用于船用发动机的推进部件,因此被选为研究材料。刀具材料选择钨铜。采用中央复合设计(CCD)的响应面方法论(RSM),以电流、脉冲导通时间、电压和占空比作为机器变量进行试验。通过 X 射线衍射 (XRD) 来估算已加工和未加工试样的 d 空间晶格。此外,还使用扫描电子显微镜(SEM)分析了加工后表面残余应力的影响。模型表明,电压和通电时间是影响残余应力的关键因素,而占空比和电流的影响较小。加工表面的残余应力产生于加工过程中的逐渐加热和冷却。通过验证测试,预测所开发的模型是准确的。微裂纹产生于工件加工过程中产生的热应力。
Modeling of Residual Stress During EDM of AISI 4340 for Marine Propulsion Application
This investigation is conducted to estimate the extent of residual stress induced in the workpiece when machined on EDM. The Residual stresses induced post machining a product can led to lower life and inadequate failures during service. AISI 4340 finds its applicability in propulsion parts of marine engine and thus chosen as the material for study. Tungsten-Copper is selected as material for tool. Response Surface Methodology (RSM) with Central Composite Design (CCD) is utilized preparing the trails using current, on-time of pulse, voltage, and duty factor as machine variables. X-Ray Diffraction (XRD) was performed to estimate the d-space lattice of machined as well as un-machined specimens. Furthermore, Scanning Electron Microscopy (SEM) was executed to analyze effect of residual stress on surface post machining. The model suggested that voltage and on duration were crucial factors for residual stress while duty factor and current were less influential. Residual stress in the machined surface results from gradual heating and cooling during machining. The developed model was predicted to be accurate through the validation test. The micro-cracks resulted from the thermal stresses developed during machining of the workpiece.
期刊介绍:
The International Journal of Maritime Engineering (IJME) provides a forum for the reporting and discussion on technical and scientific issues associated with the design and construction of commercial marine vessels . Contributions in the form of papers and notes, together with discussion on published papers are welcomed.