掺氮四面体无定形碳光学透明薄膜电极

Nina Baule, L. Haubold, T. Schuelke
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摘要

掺氮四面体无定形碳(ta-C:N)具有与掺硼金刚石(BDD)相媲美的电化学特性,但可以在低温下沉积,而且可扩展的基底面积大大超过目前 BDD 所能达到的面积。与其他碳基和金属基电极相比,ta-C:N 的电阻率相对较高,因此大多数已发表的有关 ta-C:N 电极的研究都侧重于沉积在导电基底上的薄膜。然而,电化学的一些最引人注目的应用,如光学透明光谱电化学装置,需要绝缘基底,如熔融石英玻璃(FSG)或聚合物。在这项研究中,我们通过激光控制脉冲阴极真空电弧(Laser-Arc)在绝缘 FSG 上沉积了 50 nm 的 ta-C:N,以研究与导电硅(c-Si)基底相比的电化学响应。在循环伏安法(CV)过程中,在 FSG 电极上无法观察到亚铁氰化钾的氧化或还原。为了解决这个问题,我们在 ta-C:N 和 FSG 之间引入了通过磁控溅射沉积的 5 nm 铬 (Cr) 中间层。与 c-Si 电极相比,这种电极结构可产生清晰的铁氰化钾阴极和阳极 CV 峰,但峰值分离度增加。不过,通过优化铬溅射条件和对 FSG 表面进行氩等离子预处理,可将峰值分离降低到与沉积在晶体硅上的 ta-C:N 值相当。原子力显微镜显示,这些变化改善了铬的生长均匀性,从而提高了通过四点探针测量确定的铬夹层的导电性。
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Nitrogen-incorporated tetrahedral amorphous carbon optically transparent thin film electrode
Nitrogen-incorporated tetrahedral amorphous carbon (ta-C:N) has electrochemical properties that are comparable to boron-doped diamond (BDD), but can be deposited at low temperatures, and is scalable across substrate areas substantially exceeding what is currently possible for BDD. Most published studies of ta-C:N electrodes focus on films deposited on conductive substrates due to the relatively high resistivity of ta-C:N compared to other carbon and metal-based electrodes. However, some of the most compelling applications of electrochemistry, for example, optically transparent spectroelectrochemical devices, require insulating substrates such as fused silica glass (FSG) or polymers. In this study, we deposited 50 nm of ta-C:N by laser controlled pulsed cathodic vacuum arc (Laser-Arc) onto insulating FSG to investigate the electrochemical response compared to conductive silicon (c-Si) substrates. No oxidation or reduction of potassium ferrocyanide during cyclic voltammetry (CV) could be observed at the FSG electrode. To address this, we introduced a 5 nm chromium (Cr) interlayer deposited by magnetron sputtering between ta-C:N and FSG. This electrode configuration led to clear cathodic and anodic CV peaks of potassium ferro/ferricyanide but with an increased peak separation compared to the c-Si electrode. However, the peak separation could be reduced to values comparable to ta-C:N deposited on c-Si by optimizing Cr sputtering conditions and introducing an argon plasma pretreatment of the FSG surface. Atomic force microscopy revealed that these changes improved the Cr growth homogeneity, which in turn increased the electrical conductivity of the Cr interlayer as determined by 4-point probe measurements.
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