利用面波抑制实现高隔离共极化微带全双工天线

IF 4.8 2区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Antennas and Wireless Propagation Letters Pub Date : 2024-08-02 DOI:10.1109/LAWP.2024.3436921
Rupa Laller;Mahesh P. Abegaonkar;Ananjan Basu
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引用次数: 0

摘要

这封信介绍了一种新的两层基板方法,旨在提高两个紧密排列的天线之间的隔离。该方法包括通过积分衬底之间的两条去耦线来减轻表面波。基于共模和差模阻抗的变化解释了解耦方案的综合。此外,表面波的减少是通过在地平面上创建一个槽来实现的。该结构的制造原型在5.78 GHz至5.98 GHz频段内具有40 dB的隔离度,在5.92 GHz频段最大隔离度可达70 dB。所提出的结构简单,成本效益高,具有良好的辐射模式,使其成为5G/6G全双工应用的良好候选者。
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Highly Isolated Copolarized Microstrip Full-Duplex Antenna by Surface-Waves Suppression
This letter introduces a novel two-layer substrate approach aimed at enhancing the isolation between two closely packed antennas. The method involves mitigating the surface waves by integrating two decoupling lines between the substrates. Decoupling scheme synthesis is explained based on variation in common and differential mode impedances. Furthermore, a reduction in the surface waves is achieved by creating a slot in the ground plane. A fabricated prototype of the proposed structure exhibits 40 dB isolation within the 5.78 GHz to 5.98 GHz band, with maximum isolation of up to 70 dB at 5.92 GHz. The proposed structure is simple, cost-effective, and has good radiation patterns, which make it a good candidate for 5G/6G full-duplex applications.
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来源期刊
CiteScore
8.00
自引率
9.50%
发文量
529
审稿时长
1.0 months
期刊介绍: IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.
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