论垂直接地电极的高频性能和 LRM 应用

IF 2 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-07 DOI:10.1109/TEMC.2024.3435788
Omar Kherif;Stephen Robson;Huw Griffiths;Noureddine Harid;David Thorpe;Abderrahmane Haddad
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引用次数: 0

摘要

本文探讨了在正常和故障条件下为保护个人和电气设备而降低接地阻抗的关键需求。虽然低频应用中存在许多技术,但由于接地系统固有的电感行为,在较高频率下会出现挑战。本文研究了低电阻率材料作为降低高频接地阻抗的解决方案的功效。通过使用不同长度的垂直接地电极和一些回填了商用导电骨料化合物的电极进行实验研究,分析了 10 Hz 至 10 MHz 频率范围内的接地阻抗。接地阻抗大大降低。根据这些发现和其他已公布的结果,得出了设计有效接地系统的实用见解,并提出了替代安排,显示出进一步提高高频性能的良好效果。
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On the High Frequency Performance of Vertical Ground Electrodes and LRM Application
This article addresses the critical need to reduce grounding impedance for the protection of both individuals and electrical equipment under normal and faulty conditions. While numerous techniques exist for low-frequency applications, challenges arise at higher frequencies due to the inductive behavior inherent in grounding systems. The efficacy of low resistivity material as a solution to decrease grounding impedance at high frequencies is investigated. Through experimental studies using vertical ground electrodes with varied lengths and some backfilled with a commercial conductive aggregate compound, grounding impedance is analyzed across the frequency range between 10 Hz and 10 MHz. A considerable reduction in grounding impedance is achieved. Based on these findings and other published results, practical insights for designing effective grounding systems are derived, where alternative arrangements are proposed, exhibiting promising results for further enhancing high-frequency performance.
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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