{"title":"设计硅芯同轴 TSV 以减少 3D 集成电路应用中的串扰效应","authors":"Krishna Pal, Bheemappa Halavar, V. Ramesh Kumar","doi":"10.1080/03772063.2024.2385720","DOIUrl":null,"url":null,"abstract":"This paper presents the effectiveness of the copper (Cu)-based coaxial through silicon vias (CTSVs) to reduce crosstalk noise and propagation delay. In the proposed CTSVs, the polymer liners are us...","PeriodicalId":50375,"journal":{"name":"IETE Journal of Research","volume":"1 1","pages":""},"PeriodicalIF":1.3000,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design of Silicon Core Coaxial TSVs to Reduce Crosstalk Effects for 3D IC Applications\",\"authors\":\"Krishna Pal, Bheemappa Halavar, V. Ramesh Kumar\",\"doi\":\"10.1080/03772063.2024.2385720\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the effectiveness of the copper (Cu)-based coaxial through silicon vias (CTSVs) to reduce crosstalk noise and propagation delay. In the proposed CTSVs, the polymer liners are us...\",\"PeriodicalId\":50375,\"journal\":{\"name\":\"IETE Journal of Research\",\"volume\":\"1 1\",\"pages\":\"\"},\"PeriodicalIF\":1.3000,\"publicationDate\":\"2024-08-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IETE Journal of Research\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://doi.org/10.1080/03772063.2024.2385720\",\"RegionNum\":4,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IETE Journal of Research","FirstCategoryId":"94","ListUrlMain":"https://doi.org/10.1080/03772063.2024.2385720","RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Design of Silicon Core Coaxial TSVs to Reduce Crosstalk Effects for 3D IC Applications
This paper presents the effectiveness of the copper (Cu)-based coaxial through silicon vias (CTSVs) to reduce crosstalk noise and propagation delay. In the proposed CTSVs, the polymer liners are us...
期刊介绍：
IETE Journal of Research is a Bimonthly journal published by the Institution of Electronics and Telecommunication Engineers (IETE), India. It publishes scientific and technical papers describing original research work or novel product/process development. Occasionally special issues are brought out on new and emerging research areas.
IETE Journal of Research is useful to researchers, engineers, scientists, teachers, managers and students who are interested in keeping a track of original research and development work being carried out in the broad area of electronics, telecommunications, computer science and engineering and information technology.
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