Yuncui Chen, Baocheng Zhou, Huibin Zhu, Haiyan Li, Ruicheng Feng, Hui Cao and Chunli Lei
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This paper compares the effects of CC and UEVC processes on cutting forces and subsurface damage based on molecular dynamics simulation methods, and the effects of elliptical vibration frequencies and amplitude ratios (AR) on surface morphology, roughness, and subsurface damage are investigated. The results show that the cutting force and subsurface damage in the UEVC process are reduced compared with that in the CC. Due to the vibration frequency, the subsurface damage is mainly dominated by atomic clusters, and both surface and subsurface masses show an optimization trend as the vibration frequency decreases. In terms of the AR, the surface quality is better at an AR of 2/3, with less activation of immovable dislocations, and the degree of subsurface damage decreases as the AR increases, and a relatively stable defective structure emerges when the AR is 1/2. 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引用次数: 0
摘要
钛铝合金因其优异的机械性能而受到航空航天工业的青睐。然而,由于其本身的脆性,使用传统切削(CC)工艺会导致切削力大、切削温度高的问题,进而影响加工表面质量。超声波椭圆振动切割(UEVC)已被证明是改善难加工材料表面质量和减少表面下损伤的有效方法。本文基于分子动力学模拟方法,比较了 CC 和 UEVC 工艺对切削力和表面下损伤的影响,并研究了椭圆振动频率和振幅比 (AR) 对表面形态、粗糙度和表面下损伤的影响。结果表明,与 CC 工艺相比,UEVC 工艺的切削力和表面下损伤都有所降低。由于振动频率的原因,次表层损伤主要以原子团为主,随着振动频率的降低,表面和次表层质量都呈现出优化趋势。就 AR 而言,当 AR 为 2/3 时,表面质量较好,不可移动位错的活化程度较低;随着 AR 的增大,次表层损伤程度减小;当 AR 为 1/2 时,出现了相对稳定的缺陷结构。模拟结果有助于在原子尺度上理解 UEVC 的去除机制,并进一步为 UEVC 单晶 γ-TiAl 合金的表面质量和次表面损伤机制以及振动参数的优化提供了理论基础。
Effect of UEVC parameters on cutting surface quality and subsurface damage of single crystal γ-TiAl alloy via atomic simulation
TiAl alloys are favored by the aerospace industry due to its excellent mechanical properties. However, its intrinsic brittleness, the use of conventional cutting (CC) process leads to the problems of high cutting force and high cutting temperature, which in turn affects the machined surface quality. Ultrasonic elliptical vibratory cutting (UEVC) has been proved to be an effective method to improve the surface quality and reduce the subsurface damage of difficult-to-machine materials. This paper compares the effects of CC and UEVC processes on cutting forces and subsurface damage based on molecular dynamics simulation methods, and the effects of elliptical vibration frequencies and amplitude ratios (AR) on surface morphology, roughness, and subsurface damage are investigated. The results show that the cutting force and subsurface damage in the UEVC process are reduced compared with that in the CC. Due to the vibration frequency, the subsurface damage is mainly dominated by atomic clusters, and both surface and subsurface masses show an optimization trend as the vibration frequency decreases. In terms of the AR, the surface quality is better at an AR of 2/3, with less activation of immovable dislocations, and the degree of subsurface damage decreases as the AR increases, and a relatively stable defective structure emerges when the AR is 1/2. The simulation results facilitate an atomic-scale comprehension of the removal mechanism of UEVC and further provide a theoretical foundation for the surface mass and subsurface damage mechanism and optimization of vibrational parameters of UEVC single crystal γ-TiAl alloy.
期刊介绍:
Serving the multidisciplinary materials community, the journal aims to publish new research work that advances the understanding and prediction of material behaviour at scales from atomistic to macroscopic through modelling and simulation.
Subject coverage:
Modelling and/or simulation across materials science that emphasizes fundamental materials issues advancing the understanding and prediction of material behaviour. Interdisciplinary research that tackles challenging and complex materials problems where the governing phenomena may span different scales of materials behaviour, with an emphasis on the development of quantitative approaches to explain and predict experimental observations. Material processing that advances the fundamental materials science and engineering underpinning the connection between processing and properties. Covering all classes of materials, and mechanical, microstructural, electronic, chemical, biological, and optical properties.