{"title":"添加微量锌对 Cu/Sn-10Bi/Cu 焊点电迁移的影响","authors":"Jia-yu Zhang, Feng-jiang Wang, Yan-xin Qiao","doi":"10.1007/s42243-024-01301-7","DOIUrl":null,"url":null,"abstract":"<p>The electromigration reliability on Sn–10Bi solder joints is investigated and the performance is tried to be improved with trace Zn addition in solder by depressing the growth of interfacial intermetallic compounds (IMCs) under electromigration. The electromigration test was realized on Cu/solder/Cu linear specimens at a current density of 1.0 × 10<sup>4</sup> A/cm<sup>2</sup> with different stressing time. It was found that Bi atoms in Cu/Sn–10Bi/Cu solder joint were driven towards anode side under current driving force and then accumulated at anode interface with current stressing time increasing. The thickness and growth rate of Cu<sub>6</sub>Sn<sub>5</sub> IMCs at anode interface were obviously larger than those at cathode side due to polarity effect. The addition of 0.2 wt.% Zn inhibited the migration of Bi atoms during the electromigration process, and the composition of interfacial IMCs was transformed into Cu<sub>6</sub>(Sn, Zn)<sub>5</sub>, which played as a diffusion barrier to effectively reduce the asymmetric growth of IMCs and the consumption of Cu substrate during electromigation.</p>","PeriodicalId":16151,"journal":{"name":"Journal of Iron and Steel Research International","volume":null,"pages":null},"PeriodicalIF":2.5000,"publicationDate":"2024-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of trace Zn addition on electromigration of Cu/Sn–10Bi/Cu solder joints\",\"authors\":\"Jia-yu Zhang, Feng-jiang Wang, Yan-xin Qiao\",\"doi\":\"10.1007/s42243-024-01301-7\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>The electromigration reliability on Sn–10Bi solder joints is investigated and the performance is tried to be improved with trace Zn addition in solder by depressing the growth of interfacial intermetallic compounds (IMCs) under electromigration. The electromigration test was realized on Cu/solder/Cu linear specimens at a current density of 1.0 × 10<sup>4</sup> A/cm<sup>2</sup> with different stressing time. It was found that Bi atoms in Cu/Sn–10Bi/Cu solder joint were driven towards anode side under current driving force and then accumulated at anode interface with current stressing time increasing. The thickness and growth rate of Cu<sub>6</sub>Sn<sub>5</sub> IMCs at anode interface were obviously larger than those at cathode side due to polarity effect. The addition of 0.2 wt.% Zn inhibited the migration of Bi atoms during the electromigration process, and the composition of interfacial IMCs was transformed into Cu<sub>6</sub>(Sn, Zn)<sub>5</sub>, which played as a diffusion barrier to effectively reduce the asymmetric growth of IMCs and the consumption of Cu substrate during electromigation.</p>\",\"PeriodicalId\":16151,\"journal\":{\"name\":\"Journal of Iron and Steel Research International\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.5000,\"publicationDate\":\"2024-08-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Iron and Steel Research International\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1007/s42243-024-01301-7\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Iron and Steel Research International","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1007/s42243-024-01301-7","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effect of trace Zn addition on electromigration of Cu/Sn–10Bi/Cu solder joints
The electromigration reliability on Sn–10Bi solder joints is investigated and the performance is tried to be improved with trace Zn addition in solder by depressing the growth of interfacial intermetallic compounds (IMCs) under electromigration. The electromigration test was realized on Cu/solder/Cu linear specimens at a current density of 1.0 × 104 A/cm2 with different stressing time. It was found that Bi atoms in Cu/Sn–10Bi/Cu solder joint were driven towards anode side under current driving force and then accumulated at anode interface with current stressing time increasing. The thickness and growth rate of Cu6Sn5 IMCs at anode interface were obviously larger than those at cathode side due to polarity effect. The addition of 0.2 wt.% Zn inhibited the migration of Bi atoms during the electromigration process, and the composition of interfacial IMCs was transformed into Cu6(Sn, Zn)5, which played as a diffusion barrier to effectively reduce the asymmetric growth of IMCs and the consumption of Cu substrate during electromigation.
期刊介绍：
Publishes critically reviewed original research of archival significance
Covers hydrometallurgy, pyrometallurgy, electrometallurgy, transport phenomena, process control, physical chemistry, solidification, mechanical working, solid state reactions, materials processing, and more
Includes welding & joining, surface treatment, mathematical modeling, corrosion, wear and abrasion
Journal of Iron and Steel Research International publishes original papers and occasional invited reviews on aspects of research and technology in the process metallurgy and metallic materials. Coverage emphasizes the relationships among the processing, structure and properties of metals, including advanced steel materials, superalloy, intermetallics, metallic functional materials, powder metallurgy, structural titanium alloy, composite steel materials, high entropy alloy, amorphous alloys, metallic nanomaterials, etc..
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