用于 6 千兆赫以下 5G 通信的三重带阻 2.5D 频率选择表面

IF 2 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-26 DOI:10.1109/TEMC.2024.3445292
Kanishka Katoch;Naveen Jaglan;Binod Kumar Kanaujia;Pai-Yen Chen;Ahmed A. Kishk
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引用次数: 0

摘要

本文介绍了用于第五代(5G)通信系统的小型化三频带阻挡频率选择表面(FSS)的设计。在介质基板的顶部和底部蚀刻了螺旋形蜿蜒线。为了增加 FSS 的电气长度,螺旋边缘使用四个通孔相互连接。所提出的设计占地面积为 5.2 × 5.2 mm2,在 6 GHz 以下频段 NR n46、LTE 42/LTE43 和 LTE 46 具有三重带阻响应。设计简单,成本效益高。作为一种具有旋转对称性的微型结构,它表现出与极化无关的特性,在正入射角和斜入射角分别达到 84°(模拟)和 60°(实测)时具有稳定的频率响应。传输特性通过模拟和实验得到了验证。所提出的设计可用于屏蔽 5G 运营设备。
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Triple Bandstop 2.5D Frequency Selective Surface for Sub-6 GHz 5G Communication
The design of a miniaturized triple bandstop frequency selective surface (FSS) is presented for 5th generation (5G) communication systems. Meander lines in a spiral shape have been etched on the top and bottom of a dielectric substrate. To increase the electrical length of the FSS, the spirals are interconnected using four vias at the edges. The proposed design with a 5.2 × 5.2 mm 2 footprint exhibits a triple bandstop response at sub-6 GHz frequency bands NR n46, LTE 42/LTE43, and LTE 46. The design is simple and cost-effective. As a miniaturized structure with rotational symmetry, it manifests polarization-independent characteristics with a stable frequency response for normal and oblique incident angles up to 84° (simulated) and 60° (measured). The transmission characteristics are verified using simulation and experiments. The proposed design can be used to shield 5G operational devices.
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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