通过激光和 CMT 焊接连接 Incoloy825/X65 复合板的新方法

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Journal of Manufacturing Processes Pub Date : 2024-08-29 DOI:10.1016/j.jmapro.2024.08.062
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引用次数: 0

摘要

Incoloy825/X65 复合板具有较高的抗 Cl- 腐蚀性和良好的机械性能,因此在海底运输管道中具有良好的应用前景。但在焊接复合板过渡层时,Fe 加入 Ni 层会降低其耐腐蚀性能。有鉴于此,本文分别采用了先对无填充金属的镍层进行激光焊接,再用钢填充金属的摆弧 CMT 焊接作为过渡,以抑制铁进入镍层。结果表明,镍层上的激光焊珠具有均匀且精细的 γ 显微结构,确保了较好的耐腐蚀性能。通过优化焊接速度和电弧摆动频率,CMT 焊接将稀释率控制在 6% 以下。最终,过渡焊缝的抗拉强度达到了 500 兆帕,超过了母材的 490 兆帕。焊珠的电荷转移电阻为 756 kΩ-cm2 ,满足了一般海底管道的防腐要求。
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A new method for joining Incoloy825/X65 composite plate by laser and CMT welding

Incoloy825/X65 composite plate had good application in the submarine transporting pipelines due to combination of the high resistance to Cl corrosion and preferred mechanical properties. But the enrollment of Fe into Ni layer deteriorated the corrosion resistance in welding the transition layer of composite plate. In view of this, the paper respectively adopted the laser welding on the Ni layer without filler metal and then the swing arc CMT welding with steel filler metal as a transition in order to inhibit the Fe into Ni layer. The results showed the laser welding bead on Ni layer with uniform and fine γ microstructure ensured the better corrosion resistance. The CMT welding controlled the dilution rate under 6 % through optimizing the welding speed and swing frequency of arc. Finally, the tensile strength of transition weld was up to 500 MPa surpassing the base metal of 490 MPa. The clad bead with charge transfer resistance of 756 kΩ·cm2 satisfied general submarine pipeline anti-corrosion requirement.

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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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