Lei Wang, Hongyue Wang, Chengyang Luo, Yiqiang Chen
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引用次数: 0
摘要
本研究提出了两种差分磁场谐振探头,包括 U 型单回路谐振探头 (S_probe) 和双回路谐振探头 (D_probe)。这些谐振探头由一对低电平谐振电路、一对具有两个输出端的带状线、两排通孔栅栏和两种不同的传感结构(单回路和双回路)组成。其中,一对作为电容器的开路存根和作为电感器的短路存根构成 LC 谐振电路,通孔栅栏用于抑制不需要的电磁波模式,一个 U 形单环和一对差分双环用于接收电磁信号。为了证明设计的合理性,对 S_probe 和 D_probe 的仿真模型进行了优化,并基于四层印刷电路板进行了制造。此外,还使用了一个以标准 50 Ω 直微带线为校准套件的近场扫描系统来测量和校准这些谐振探头。测试结果表明,这些设计的磁场探头可在 1.575 GHz 频率下工作,并具有较高的探测灵敏度和电场抑制能力。
New resonant composite magnetic-field probes with high detection sensitivity and electric-field suppression ratio
This work proposes two differential magnetic-field resonant probes, consisting of a U-shaped single-loop resonant probe (S_probe) and a dual-loops resonant probe (D_probe). These resonant probes are composed of a pair of LC resonant circuits, a pair of strip-lines with two outputs, two rows of via fences, and two different sensing structures (single-loop and dual-loops). Among them, a pair of open stubs as capacitor and shorted stubs as inductor is used to form the LC resonant circuit, via fences are utilized to suppress unwanted electromagnetic wave modes, a U-shaped single-loop and a pair of differential dual-loops is used to receive the electromagnetic signal. In order to prove the rationality of the design, simulation models of the S_probe and D_probe are optimized and manufactured based on four-layers PCBs. In addition, a near-field scanning system with a standard 50 Ω straight microstrip line as calibration kit is used to measure and calibrate these resonant probes. The tested results indicate that these designed magnetic-field probes could operate at 1.575 GHz and have high detection sensitivity and electric-field suppression.
期刊介绍:
IET Power Electronics aims to attract original research papers, short communications, review articles and power electronics related educational studies. The scope covers applications and technologies in the field of power electronics with special focus on cost-effective, efficient, power dense, environmental friendly and robust solutions, which includes:
Applications:
Electric drives/generators, renewable energy, industrial and consumable applications (including lighting, welding, heating, sub-sea applications, drilling and others), medical and military apparatus, utility applications, transport and space application, energy harvesting, telecommunications, energy storage management systems, home appliances.
Technologies:
Circuits: all type of converter topologies for low and high power applications including but not limited to: inverter, rectifier, dc/dc converter, power supplies, UPS, ac/ac converter, resonant converter, high frequency converter, hybrid converter, multilevel converter, power factor correction circuits and other advanced topologies.
Components and Materials: switching devices and their control, inductors, sensors, transformers, capacitors, resistors, thermal management, filters, fuses and protection elements and other novel low-cost efficient components/materials.
Control: techniques for controlling, analysing, modelling and/or simulation of power electronics circuits and complete power electronics systems.
Design/Manufacturing/Testing: new multi-domain modelling, assembling and packaging technologies, advanced testing techniques.
Environmental Impact: Electromagnetic Interference (EMI) reduction techniques, Electromagnetic Compatibility (EMC), limiting acoustic noise and vibration, recycling techniques, use of non-rare material.
Education: teaching methods, programme and course design, use of technology in power electronics teaching, virtual laboratory and e-learning and fields within the scope of interest.
Special Issues. Current Call for papers:
Harmonic Mitigation Techniques and Grid Robustness in Power Electronic-Based Power Systems - https://digital-library.theiet.org/files/IET_PEL_CFP_HMTGRPEPS.pdf