三维复杂等离子体隙内纳米结构的合成及其在表面增强拉曼散射中的应用的最新进展

Biosensors Pub Date : 2024-09-06 DOI:10.3390/bios14090433
Li Ma, Keyi Zhou, Xinyue Wang, Jiayue Wang, Ruyu Zhao, Yifei Zhang, Fang Cheng
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引用次数: 0

摘要

等离子隙内纳米结构(PINs)具有增强光物质相互作用的卓越能力,因此在拉曼相关分析领域受到广泛关注。虽然人们采用了多种合成策略来制造这些纳米结构,但重点主要放在结构简单的 PINs 上,而这些 PINs 通常无法实现有效的近场聚焦。三维(3D)复杂 PIN 因其复杂的内部间隙和空隙网络而与众不同,正在成为有效捕光的卓越结构。这些结构有利于产生对增强近场聚焦至关重要的热点和热区。然而,这些复杂结构的合成技术及其对近场聚焦的具体影响并没有得到很好的记录。本综述将讨论三维复杂 PINs 合成及其在表面增强拉曼散射 (SERS) 中应用的最新进展。我们首先介绍了制造简单 PIN 的基本方法,然后讨论了旨在开发具有卓越近场聚焦能力的三维复合 PIN 的合理设计策略。我们还评估了各种三维复合 PIN 的 SERS 性能,强调了它们的先进传感能力。最后,我们探讨了三维复合 PIN 在 SERS 应用中的未来前景。
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Recent Progress in the Synthesis of 3D Complex Plasmonic Intragap Nanostructures and Their Applications in Surface-Enhanced Raman Scattering
Plasmonic intragap nanostructures (PINs) have garnered intensive attention in Raman-related analysis due to their exceptional ability to enhance light–matter interactions. Although diverse synthetic strategies have been employed to create these nanostructures, the emphasis has largely been on PINs with simple configurations, which often fall short in achieving effective near-field focusing. Three-dimensional (3D) complex PINs, distinguished by their intricate networks of internal gaps and voids, are emerging as superior structures for effective light trapping. These structures facilitate the generation of hot spots and hot zones that are essential for enhanced near-field focusing. Nevertheless, the synthesis techniques for these complex structures and their specific impacts on near-field focusing are not well-documented. This review discusses the recent advancements in the synthesis of 3D complex PINs and their applications in surface-enhanced Raman scattering (SERS). We begin by describing the foundational methods for fabricating simple PINs, followed by a discussion on the rational design strategies aimed at developing 3D complex PINs with superior near-field focusing capabilities. We also evaluate the SERS performance of various 3D complex PINs, emphasizing their advanced sensing capabilities. Lastly, we explore the future perspective of 3D complex PINs in SERS applications.
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