Perspective for in-volume machining of solid materials by undersurface focusing of x-ray pulses

In this perspective article we propose and discuss a possible technique of in-depth material processing based on undersurface focusing of intense x-ray pulses. Currently, x-ray free-electron lasers can produce such intense x-ray pulses with femtosecond pulse durations, reaching intensities sufficiently high to cause ultrafast melting of a material after a single laser shot. Here, on the example of silicon crystal we will demonstrate that with a proper choice of pulse parameters and focusing parameters, the already existing nanofocusing setup has a capability to focus hard x rays down to several hundreds micrometers below the material surface. This can trigger the required structural modification in the focal point, without damaging the material above. Potential applications of the new technique are discussed.