{"title":"受控化学放电加工（ECDM）的工艺稳定性和可持续性","authors":"Dil Bahar, Akshay Dvivedi, Pradeep Kumar","doi":"10.1080/10426914.2024.2390388","DOIUrl":null,"url":null,"abstract":"To mitigate the transmission losses, glass vias have the potential to replace silicon vias in wireless transmission systems. In the wake of limitations of the existing methods, ECDM is an evolving ...","PeriodicalId":18266,"journal":{"name":"Materials and Manufacturing Processes","volume":null,"pages":null},"PeriodicalIF":4.1000,"publicationDate":"2024-08-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"On process stability and sustainability of controlled-Electro Chemical Discharge Machining (ECDM)\",\"authors\":\"Dil Bahar, Akshay Dvivedi, Pradeep Kumar\",\"doi\":\"10.1080/10426914.2024.2390388\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To mitigate the transmission losses, glass vias have the potential to replace silicon vias in wireless transmission systems. In the wake of limitations of the existing methods, ECDM is an evolving ...\",\"PeriodicalId\":18266,\"journal\":{\"name\":\"Materials and Manufacturing Processes\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.1000,\"publicationDate\":\"2024-08-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials and Manufacturing Processes\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1080/10426914.2024.2390388\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, MANUFACTURING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials and Manufacturing Processes","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/10426914.2024.2390388","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
On process stability and sustainability of controlled-Electro Chemical Discharge Machining (ECDM)
To mitigate the transmission losses, glass vias have the potential to replace silicon vias in wireless transmission systems. In the wake of limitations of the existing methods, ECDM is an evolving ...
期刊介绍：
Materials and Manufacturing Processes deals with issues that result in better utilization of raw materials and energy, integration of design and manufacturing activities requiring the invention of suitable new manufacturing processes and techniques, unmanned production dependent on efficient and reliable control of various processes including intelligent processing, introduction of new materials in industrial production necessitating new manufacturing process technology, and more. Information is offered in various formats, including research articles, letter reports, review articles, conference papers, applied research, book and conference reviews, and entire issues devoted to symposia.
All submitted manuscripts are subject to initial appraisal by the Editors, and, if found suitable for further consideration, to peer review by independent, anonymous expert referees. All peer review is single blind and submission is online via ScholarOne Manuscripts.
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