冷喷沉积行为的原子模拟

IF 2.7 3区 物理与天体物理 Q2 PHYSICS, APPLIED Journal of Applied Physics Pub Date : 2024-09-09 DOI:10.1063/5.0218416
Jianrui Feng, Erfeng An, Wensen Zhao
{"title":"冷喷沉积行为的原子模拟","authors":"Jianrui Feng, Erfeng An, Wensen Zhao","doi":"10.1063/5.0218416","DOIUrl":null,"url":null,"abstract":"Cold spray is an effective method for surface coating, which has been applied in various engineering areas. However, it is difficult to directly observe the dynamic deformation process in experiments. This paper applies the molecular dynamics simulation to model the deposition of a monocrystalline Cu particle onto a Cu substrate and, subsequently, carries out a systematic study on the deposition mechanism and microstructure evolution. The results indicate that the deposition process consists of an impact stage and a relaxation stage. It is mainly the high speed collision and the friction following the collision that lead to particle deposition, which, under different circumstances, can be defined as surface deposition or penetration deposition. Two methods, namely, drastic shear deformation and cooling in the relaxation stage, can help form nanocrystallines. Jetting and melting are not the necessary factors for the deposition of nano-sized particles. The formation of dislocation lines is influenced by impact velocities. At lower impact velocities, the dislocation lines are mainly distributed near the contact surface. However, when the impact velocity is higher, dislocation lines are almost uniformly distributed in the particle.","PeriodicalId":15088,"journal":{"name":"Journal of Applied Physics","volume":"15 1","pages":""},"PeriodicalIF":2.7000,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Atomistic simulation on the deposition behavior of cold spray\",\"authors\":\"Jianrui Feng, Erfeng An, Wensen Zhao\",\"doi\":\"10.1063/5.0218416\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Cold spray is an effective method for surface coating, which has been applied in various engineering areas. However, it is difficult to directly observe the dynamic deformation process in experiments. This paper applies the molecular dynamics simulation to model the deposition of a monocrystalline Cu particle onto a Cu substrate and, subsequently, carries out a systematic study on the deposition mechanism and microstructure evolution. The results indicate that the deposition process consists of an impact stage and a relaxation stage. It is mainly the high speed collision and the friction following the collision that lead to particle deposition, which, under different circumstances, can be defined as surface deposition or penetration deposition. Two methods, namely, drastic shear deformation and cooling in the relaxation stage, can help form nanocrystallines. Jetting and melting are not the necessary factors for the deposition of nano-sized particles. The formation of dislocation lines is influenced by impact velocities. At lower impact velocities, the dislocation lines are mainly distributed near the contact surface. However, when the impact velocity is higher, dislocation lines are almost uniformly distributed in the particle.\",\"PeriodicalId\":15088,\"journal\":{\"name\":\"Journal of Applied Physics\",\"volume\":\"15 1\",\"pages\":\"\"},\"PeriodicalIF\":2.7000,\"publicationDate\":\"2024-09-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Applied Physics\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://doi.org/10.1063/5.0218416\",\"RegionNum\":3,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"PHYSICS, APPLIED\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Applied Physics","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.1063/5.0218416","RegionNum":3,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"PHYSICS, APPLIED","Score":null,"Total":0}
引用次数: 0

摘要

冷喷是一种有效的表面涂层方法,已被应用于多个工程领域。然而,在实验中很难直接观察到动态变形过程。本文应用分子动力学模拟建立了单晶铜粒子在铜基底上的沉积模型,并随后对沉积机理和微观结构演变进行了系统研究。结果表明,沉积过程由碰撞阶段和弛豫阶段组成。主要是高速碰撞和碰撞后的摩擦导致颗粒沉积,在不同情况下,可定义为表面沉积或渗透沉积。急剧的剪切变形和松弛阶段的冷却这两种方法有助于形成纳米晶体。喷射和熔化并不是纳米级颗粒沉积的必要因素。位错线的形成受冲击速度的影响。在较低的冲击速度下,位错线主要分布在接触面附近。然而,当冲击速度较高时,位错线几乎均匀地分布在颗粒中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Atomistic simulation on the deposition behavior of cold spray
Cold spray is an effective method for surface coating, which has been applied in various engineering areas. However, it is difficult to directly observe the dynamic deformation process in experiments. This paper applies the molecular dynamics simulation to model the deposition of a monocrystalline Cu particle onto a Cu substrate and, subsequently, carries out a systematic study on the deposition mechanism and microstructure evolution. The results indicate that the deposition process consists of an impact stage and a relaxation stage. It is mainly the high speed collision and the friction following the collision that lead to particle deposition, which, under different circumstances, can be defined as surface deposition or penetration deposition. Two methods, namely, drastic shear deformation and cooling in the relaxation stage, can help form nanocrystallines. Jetting and melting are not the necessary factors for the deposition of nano-sized particles. The formation of dislocation lines is influenced by impact velocities. At lower impact velocities, the dislocation lines are mainly distributed near the contact surface. However, when the impact velocity is higher, dislocation lines are almost uniformly distributed in the particle.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Journal of Applied Physics
Journal of Applied Physics 物理-物理:应用
CiteScore
5.40
自引率
9.40%
发文量
1534
审稿时长
2.3 months
期刊介绍: The Journal of Applied Physics (JAP) is an influential international journal publishing significant new experimental and theoretical results of applied physics research. Topics covered in JAP are diverse and reflect the most current applied physics research, including: Dielectrics, ferroelectrics, and multiferroics- Electrical discharges, plasmas, and plasma-surface interactions- Emerging, interdisciplinary, and other fields of applied physics- Magnetism, spintronics, and superconductivity- Organic-Inorganic systems, including organic electronics- Photonics, plasmonics, photovoltaics, lasers, optical materials, and phenomena- Physics of devices and sensors- Physics of materials, including electrical, thermal, mechanical and other properties- Physics of matter under extreme conditions- Physics of nanoscale and low-dimensional systems, including atomic and quantum phenomena- Physics of semiconductors- Soft matter, fluids, and biophysics- Thin films, interfaces, and surfaces
期刊最新文献
Dry needling and upper cervical spinal manipulation in patients with temporomandibular disorder: A multi-center randomized clinical trial. Fast inverse design of microwave and infrared Bi-stealth metamaterials based on equivalent circuit model Calibration of Jones–Wilkins–Lee equation of state for unreacted explosives with shock Hugoniot relationship and optimization algorithm Impulse coupling enhancement of aluminum targets under laser irradiation in a soft polymer confined geometry Optimal demodulation domain for microwave SQUID multiplexers in presence of readout system noise
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1