{"title":"利用石墨辅助散热器对循环热负荷下的电子设备进行热管理","authors":"Sayan Majumder, Rajesh Akula, Chakravarthy Balaji","doi":"10.1080/01457632.2024.2392077","DOIUrl":null,"url":null,"abstract":"The primary objective of this experimental study is to establish a methodology for enhancing the operational duration and concurrently reducing thermal fluctuations within cyclically functioning el...","PeriodicalId":12979,"journal":{"name":"Heat Transfer Engineering","volume":null,"pages":null},"PeriodicalIF":1.6000,"publicationDate":"2024-08-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal Management of Electronics under Cyclic Heat Loads Using Graphite-Assisted Heat Sink\",\"authors\":\"Sayan Majumder, Rajesh Akula, Chakravarthy Balaji\",\"doi\":\"10.1080/01457632.2024.2392077\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The primary objective of this experimental study is to establish a methodology for enhancing the operational duration and concurrently reducing thermal fluctuations within cyclically functioning el...\",\"PeriodicalId\":12979,\"journal\":{\"name\":\"Heat Transfer Engineering\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2024-08-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Heat Transfer Engineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1080/01457632.2024.2392077\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Heat Transfer Engineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1080/01457632.2024.2392077","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Thermal Management of Electronics under Cyclic Heat Loads Using Graphite-Assisted Heat Sink
The primary objective of this experimental study is to establish a methodology for enhancing the operational duration and concurrently reducing thermal fluctuations within cyclically functioning el...
期刊介绍：
Publishing 18 issues per year, Heat Transfer Engineering is an unparalleled resource for key advances in the field of heat transfer for the practicing engineer and other workers in the field. The journal publishes analytical, numerical, and experimental articles of lasting interest in the general area of heat-mass transfer and the related fluid mechanics and thermodynamics.
In a clear, easy-to-read format, the journal includes refereed papers of original work, state-of-the-art reviews, articles on new developments in equipment or practices, reviews of fundamentals, heat in history articles, book reviews, news items on people and companies in the field, advertising, and any other items that may be appropriate.
All submitted manuscripts are subject to initial appraisal by the Editor and/or selected members of the Editorial Board, and, if found suitable for further consideration, to peer review by independent, anonymous expert referees.
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