E. T. Aslanova, S. Y. Heydarova, E. G. Iskenderova, B. A. Mamedov
{"title":"新型环氧-酰亚胺树脂","authors":"E. T. Aslanova, S. Y. Heydarova, E. G. Iskenderova, B. A. Mamedov","doi":"10.1134/S207511332470103X","DOIUrl":null,"url":null,"abstract":"<p><i>N</i>,<i>N</i>'-Diglycidyl-1,3-bis(carboxymethylestersulfoimide) of 2-hydroxypropyl saccharin-6-carboxylic acid is obtained by interaction of dipotassium salt of 2-hydroxypropyl-1,3-bis(carboxymethylestersulfoimide) of saccharin-6-carboxylic acid with epichlorohydrin. The structure of the epoxy-imide compound is confirmed by the data of IR spectroscopy. A thermostable hot-curing epoxy-imide composition is made on the basis of the obtained resin. A composition based on an ED-20 epoxydiane resin is also made for comparative estimation of the heat resistance of the obtained oligomer. The curing process of the composition is studied by differential thermal analysis on a derivatograph of the Paulik–Paulik–Erdey system. It is found that the degree of cure of the obtained composition under the optimal regime of curing reaches 82%. It is determined that the composite material based on the epoxy-imide resin is characterized by sufficiently high thermal indices in comparison with materials based on an ED-20 resin and can replace them in those areas where heat-resistant epoxy compounds are needed and can also be used to produce heat-resistant epoxy adhesives and coatings.</p>","PeriodicalId":586,"journal":{"name":"Inorganic Materials: Applied Research","volume":"15 5","pages":"1383 - 1387"},"PeriodicalIF":0.5000,"publicationDate":"2024-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"New Epoxy-Imide Resin\",\"authors\":\"E. T. Aslanova, S. Y. Heydarova, E. G. Iskenderova, B. A. Mamedov\",\"doi\":\"10.1134/S207511332470103X\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p><i>N</i>,<i>N</i>'-Diglycidyl-1,3-bis(carboxymethylestersulfoimide) of 2-hydroxypropyl saccharin-6-carboxylic acid is obtained by interaction of dipotassium salt of 2-hydroxypropyl-1,3-bis(carboxymethylestersulfoimide) of saccharin-6-carboxylic acid with epichlorohydrin. The structure of the epoxy-imide compound is confirmed by the data of IR spectroscopy. A thermostable hot-curing epoxy-imide composition is made on the basis of the obtained resin. A composition based on an ED-20 epoxydiane resin is also made for comparative estimation of the heat resistance of the obtained oligomer. The curing process of the composition is studied by differential thermal analysis on a derivatograph of the Paulik–Paulik–Erdey system. It is found that the degree of cure of the obtained composition under the optimal regime of curing reaches 82%. It is determined that the composite material based on the epoxy-imide resin is characterized by sufficiently high thermal indices in comparison with materials based on an ED-20 resin and can replace them in those areas where heat-resistant epoxy compounds are needed and can also be used to produce heat-resistant epoxy adhesives and coatings.</p>\",\"PeriodicalId\":586,\"journal\":{\"name\":\"Inorganic Materials: Applied Research\",\"volume\":\"15 5\",\"pages\":\"1383 - 1387\"},\"PeriodicalIF\":0.5000,\"publicationDate\":\"2024-10-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Inorganic Materials: Applied Research\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://link.springer.com/article/10.1134/S207511332470103X\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Inorganic Materials: Applied Research","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.1134/S207511332470103X","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
N,N'-Diglycidyl-1,3-bis(carboxymethylestersulfoimide) of 2-hydroxypropyl saccharin-6-carboxylic acid is obtained by interaction of dipotassium salt of 2-hydroxypropyl-1,3-bis(carboxymethylestersulfoimide) of saccharin-6-carboxylic acid with epichlorohydrin. The structure of the epoxy-imide compound is confirmed by the data of IR spectroscopy. A thermostable hot-curing epoxy-imide composition is made on the basis of the obtained resin. A composition based on an ED-20 epoxydiane resin is also made for comparative estimation of the heat resistance of the obtained oligomer. The curing process of the composition is studied by differential thermal analysis on a derivatograph of the Paulik–Paulik–Erdey system. It is found that the degree of cure of the obtained composition under the optimal regime of curing reaches 82%. It is determined that the composite material based on the epoxy-imide resin is characterized by sufficiently high thermal indices in comparison with materials based on an ED-20 resin and can replace them in those areas where heat-resistant epoxy compounds are needed and can also be used to produce heat-resistant epoxy adhesives and coatings.
期刊介绍：
Inorganic Materials: Applied Research contains translations of research articles devoted to applied aspects of inorganic materials. Best articles are selected from four Russian periodicals: Materialovedenie, Perspektivnye Materialy, Fizika i Khimiya Obrabotki Materialov, and Voprosy Materialovedeniya and translated into English. The journal reports recent achievements in materials science: physical and chemical bases of materials science; effects of synergism in composite materials; computer simulations; creation of new materials (including carbon-based materials and ceramics, semiconductors, superconductors, composite materials, polymers, materials for nuclear engineering, materials for aircraft and space engineering, materials for quantum electronics, materials for electronics and optoelectronics, materials for nuclear and thermonuclear power engineering, radiation-hardened materials, materials for use in medicine, etc.); analytical techniques; structure–property relationships; nanostructures and nanotechnologies; advanced technologies; use of hydrogen in structural materials; and economic and environmental issues. The journal also considers engineering issues of materials processing with plasma, high-gradient crystallization, laser technology, and ultrasonic technology. Currently the journal does not accept direct submissions, but submissions to one of the source journals is possible.
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