Kinetic Laws of the Cathodic Deposition of a Tin–Bismuth Alloy and the Influence of Ultradispersed Diamonds

The specific features of galvanic deposition of a tin–bismuth alloy from a sulfuric acid electrolyte and the influence of ultradispersed diamonds (UDDs) on the deposition kinetics are considered. The deposition kinetics is accompanied by diffusion hindrances that are caused, to a lower extent, by the delivery of discharged tin and bismuth ions to the cathode surface and, to a higher extent, by the diffusion of these ions through a dense adsorption film of hide glue on the cathode surface. Electrons sequentially add to tin(II) ions, and the rate-determining step is the addition of the first electron. The introduction of UDDs into the electrolyte accelerates the deposition of a tin–bismuth alloy and increases the scattering power of the electrolyte, which is related to the chemisorption of tin ions on the highly developed UDD surface.