{"title":"使用低频噪声参数测试半导体产品","authors":"M. I. Gorlov, V. A. Sergeev","doi":"10.1134/S1061830924700694","DOIUrl":null,"url":null,"abstract":"<p>This article continues and supplements the article with the same title published in <i>Russian Journal of Nondestructive Testing</i>, no. 1, 2022, which provides six ways to assess the quality and reliability of semiconductor products (SCPs) using low-frequency (LF) noise parameters. This paper presents a generalization of the results previously obtained by the authors and describes four more methods for diagnosing and evaluating the reliability of SCPs by varying the parameters of low- frequency noise under additional external influences such as electrostatic discharge and (or) thermal annealing. It is shown that additional impacts make it possible to increase the reliability of the assessment of the SCP reliability.</p>","PeriodicalId":764,"journal":{"name":"Russian Journal of Nondestructive Testing","volume":null,"pages":null},"PeriodicalIF":0.9000,"publicationDate":"2024-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Testing Semiconductor Products Using Low-Frequency Noise Parameters\",\"authors\":\"M. I. Gorlov, V. A. Sergeev\",\"doi\":\"10.1134/S1061830924700694\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>This article continues and supplements the article with the same title published in <i>Russian Journal of Nondestructive Testing</i>, no. 1, 2022, which provides six ways to assess the quality and reliability of semiconductor products (SCPs) using low-frequency (LF) noise parameters. This paper presents a generalization of the results previously obtained by the authors and describes four more methods for diagnosing and evaluating the reliability of SCPs by varying the parameters of low- frequency noise under additional external influences such as electrostatic discharge and (or) thermal annealing. It is shown that additional impacts make it possible to increase the reliability of the assessment of the SCP reliability.</p>\",\"PeriodicalId\":764,\"journal\":{\"name\":\"Russian Journal of Nondestructive Testing\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.9000,\"publicationDate\":\"2024-09-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Russian Journal of Nondestructive Testing\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://link.springer.com/article/10.1134/S1061830924700694\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"MATERIALS SCIENCE, CHARACTERIZATION & TESTING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Russian Journal of Nondestructive Testing","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1134/S1061830924700694","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}
Testing Semiconductor Products Using Low-Frequency Noise Parameters
This article continues and supplements the article with the same title published in Russian Journal of Nondestructive Testing, no. 1, 2022, which provides six ways to assess the quality and reliability of semiconductor products (SCPs) using low-frequency (LF) noise parameters. This paper presents a generalization of the results previously obtained by the authors and describes four more methods for diagnosing and evaluating the reliability of SCPs by varying the parameters of low- frequency noise under additional external influences such as electrostatic discharge and (or) thermal annealing. It is shown that additional impacts make it possible to increase the reliability of the assessment of the SCP reliability.
期刊介绍:
Russian Journal of Nondestructive Testing, a translation of Defectoskopiya, is a publication of the Russian Academy of Sciences. This publication offers current Russian research on the theory and technology of nondestructive testing of materials and components. It describes laboratory and industrial investigations of devices and instrumentation and provides reviews of new equipment developed for series manufacture. Articles cover all physical methods of nondestructive testing, including magnetic and electrical; ultrasonic; X-ray and Y-ray; capillary; liquid (color luminescence), and radio (for materials of low conductivity).