存在界面缺陷时的粘合接触强度

IF 4.3 3区 工程技术 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Extreme Mechanics Letters Pub Date : 2024-10-05 DOI:10.1016/j.eml.2024.102238
Coby K. Jones , Jamie L. Hale , Helen K. Minsky , Jamie A. Booth
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引用次数: 0

摘要

对具有主要应力集中的粘合接触(如球形接合点的接触边缘或剥离薄膜的剥离前沿)进行了深入研究。更复杂的粘合剂接合几何形状,如生物微图案干粘合剂中的蘑菇状纤维,则显示出粘合强度与接触内界面缺陷存在的复杂关系。这导致微图案子接触之间的局部行为出现统计变化。为了研究几何形状和界面缺陷特性在控制粘合强度方面的相互作用,我们对弹性层上的刚性圆柱探针模型系统进行了研究。实验(PDMS 上的玻璃)和内聚区有限元模拟均已进行,同时还考虑了分析渐近极限。改变弹性层的厚度可改变界面应力分布,较薄的弹性层可减少边缘应力集中,但会增加接触中心的应力。制造的界面缺陷的大小和位置也有变化。观察发现,对于最厚的基底,边缘应力集中占主导地位,无论接触内部是否存在界面缺陷,脱离都会从这一区域传播。只有半径大于接触半径一半的超大中心缺陷才会影响粘合强度。这种转变与分析渐近极限一致。随着基底变薄和应力分布的变化,中心缺陷半径增大时粘合强度会出现强烈衰减。对于最薄的基板,缺陷敏感上限已经接近,这表明这种衰减主要是由接触面积的减少引起的。对于径向位置不断增大的便士形缺陷,最薄基板的粘合强度变得不单调。这证实了由几何形状控制的界面应力分布与粘合接触中界面缺陷的大小和位置之间错综复杂的相互作用,当缺陷因表面粗糙度、制造缺陷或污染物颗粒而形成时,将导致强度的统计变化。
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The strength of an adhesive contact in the presence of interfacial defects
Adhesive contacts which possess a dominant stress concentration, such as at the contact edge in spherical junctions or at the detachment front in a peeling film, are well studied. More complex adhesive junction geometries, such as mushroom-shaped fibrils in bioinspired micropatterned dry adhesives, have exhibited a complex dependence of adhesive strength on the presence of interfacial defects within the contact. This has led to the emergence of statistical variation of the local behavior among micropatterned sub-contacts. In order to examine the interplay between geometry and interfacial defect character in control of the adhesive strength, the model system of a stiff cylindrical probe on an elastic layer is examined. Both experiments (glass on PDMS) and cohesive zone finite element simulations are performed, with analytical asymptotic limits also considered. The thickness of the elastic layer is varied to alter the interfacial stress distribution, with thinner layers having a reduced edge stress concentration at the expense of increased stress at the contact center. The size and position of manufactured interfacial defects is varied. It is observed that for the thickest substrates the edge stress concentration is dominant, with detachment propagating from this region regardless of the presence of an interfacial defect within the contact. Only very large center defects, with radius greater than half of that of the contact influence the adhesive strength. This transition is in agreement with analytical asymptotic limits. As the substrate is made thinner and the stress distribution changes, a strong decay in adhesive strength with increasing center defect radius emerges. For the thinnest substrate the flaw-insensitive upper bound is approached, suggesting that this decay is dominated by a reduction in the contact area. For penny-shaped defects at increasing radial positions, the adhesive strength for the thinnest substrates becomes non-monotonic. This confirms an intricate interplay between the geometry-controlled interfacial stress distribution and the size and position of interfacial defects in adhesive contacts, which will lead to statistical variation in strength when defects form due to surface roughness, fabrication imperfections, or contaminant particles.
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来源期刊
Extreme Mechanics Letters
Extreme Mechanics Letters Engineering-Mechanics of Materials
CiteScore
9.20
自引率
4.30%
发文量
179
审稿时长
45 days
期刊介绍: Extreme Mechanics Letters (EML) enables rapid communication of research that highlights the role of mechanics in multi-disciplinary areas across materials science, physics, chemistry, biology, medicine and engineering. Emphasis is on the impact, depth and originality of new concepts, methods and observations at the forefront of applied sciences.
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