Effect of HIP bonding temperature and duration on the interfacial microstructure and mechanical properties of W/steel joint with an Fe interlayer

HIP experiments were conducted at temperatures of 950, 900, and 850 °C for durations of 60, 135, and 240 min respectively in this study, the effect of bonding temperature and duration on the interfacial microstructure and mechanical properties of the joint was investigated. The results demonstrate that reducing the HIP temperature from 980 to 850 °C leads to a significant decrease in the thickness of the W/Fe reaction layer. This reduction enables bonding interfaces without reaction layer at temperatures of 900 and 850 °C. However, as the temperature decreases, there is an initial increase followed by a subsequent decrease in shear strength with a maximum shear strength achieved at 950 °C reaching up to 322 MPa. Prolonging the bonding duration at a temperature of 950 °C results in a rapid transition of W/Fe reaction layer from Fe₂W to Fe₃W₃C which weakens the overall bonding performance. Conversely, increasing the bonding duration at temperatures of 900 and 850 °C has minimal impact on both interfacial microstructure and bonding strength.