Bingheng Li;Da Li;Ling Zhang;Zheming Gu;Ruifeng Xu;Yan Li;Er-Ping Li
{"title":"利用深度迁移学习和增强型遗传算法进行引脚图设计的 EMI 预测和优化","authors":"Bingheng Li;Da Li;Ling Zhang;Zheming Gu;Ruifeng Xu;Yan Li;Er-Ping Li","doi":"10.1109/TEMC.2024.3465538","DOIUrl":null,"url":null,"abstract":"With the rapid increase in the operating frequency and integration density of ball grid array packages, pin assignment (pinmap) significantly impacts electromagnetic interference (EMI). However, the previous deep reinforcement learning (DRL) approaches required time-consuming evaluation and training procedures. In this article, we propose a novel design methodology for predicting and optimizing the EMI of pinmaps. First, we present a deep learning-based predictor that can accurately and quickly evaluate the EMI levels of pinmaps, thereby supporting fast pinmap design. Furthermore, transfer learning achieves excellent predictor performance with less training data, resulting in effective data savings. Based on the presented predictors, an enhanced genetic algorithm is developed to optimize the EMI and can quickly find better solutions compared with the DRL approaches. As a result, this article proposes a detailed guideline for predicting and optimizing the EMI of pinmaps, and the proposed methodology can be further developed for promising intelligent system-level packaging design.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 6","pages":"2123-2132"},"PeriodicalIF":2.0000,"publicationDate":"2024-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"EMI Prediction and Optimization for Pinmap Design Using Deep Transfer Learning and an Enhanced Genetic Algorithm\",\"authors\":\"Bingheng Li;Da Li;Ling Zhang;Zheming Gu;Ruifeng Xu;Yan Li;Er-Ping Li\",\"doi\":\"10.1109/TEMC.2024.3465538\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With the rapid increase in the operating frequency and integration density of ball grid array packages, pin assignment (pinmap) significantly impacts electromagnetic interference (EMI). However, the previous deep reinforcement learning (DRL) approaches required time-consuming evaluation and training procedures. In this article, we propose a novel design methodology for predicting and optimizing the EMI of pinmaps. First, we present a deep learning-based predictor that can accurately and quickly evaluate the EMI levels of pinmaps, thereby supporting fast pinmap design. Furthermore, transfer learning achieves excellent predictor performance with less training data, resulting in effective data savings. Based on the presented predictors, an enhanced genetic algorithm is developed to optimize the EMI and can quickly find better solutions compared with the DRL approaches. As a result, this article proposes a detailed guideline for predicting and optimizing the EMI of pinmaps, and the proposed methodology can be further developed for promising intelligent system-level packaging design.\",\"PeriodicalId\":55012,\"journal\":{\"name\":\"IEEE Transactions on Electromagnetic Compatibility\",\"volume\":\"66 6\",\"pages\":\"2123-2132\"},\"PeriodicalIF\":2.0000,\"publicationDate\":\"2024-10-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electromagnetic Compatibility\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10716247/\",\"RegionNum\":3,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10716247/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
EMI Prediction and Optimization for Pinmap Design Using Deep Transfer Learning and an Enhanced Genetic Algorithm
With the rapid increase in the operating frequency and integration density of ball grid array packages, pin assignment (pinmap) significantly impacts electromagnetic interference (EMI). However, the previous deep reinforcement learning (DRL) approaches required time-consuming evaluation and training procedures. In this article, we propose a novel design methodology for predicting and optimizing the EMI of pinmaps. First, we present a deep learning-based predictor that can accurately and quickly evaluate the EMI levels of pinmaps, thereby supporting fast pinmap design. Furthermore, transfer learning achieves excellent predictor performance with less training data, resulting in effective data savings. Based on the presented predictors, an enhanced genetic algorithm is developed to optimize the EMI and can quickly find better solutions compared with the DRL approaches. As a result, this article proposes a detailed guideline for predicting and optimizing the EMI of pinmaps, and the proposed methodology can be further developed for promising intelligent system-level packaging design.
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.