利用深度迁移学习和增强型遗传算法进行引脚图设计的 EMI 预测和优化

IF 2 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-10-14 DOI:10.1109/TEMC.2024.3465538
Bingheng Li;Da Li;Ling Zhang;Zheming Gu;Ruifeng Xu;Yan Li;Er-Ping Li
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引用次数: 0

摘要

随着球栅阵列封装工作频率和集成密度的快速提高,引脚分配(pinmap)对电磁干扰(EMI)产生了显著影响。然而,之前的深度强化学习(DRL)方法需要耗时的评估和训练过程。在本文中,我们提出了一种新的设计方法来预测和优化探针图的电磁干扰。首先,我们提出了一种基于深度学习的预测器,它可以准确快速地评估探针图的EMI水平,从而支持快速探针图设计。此外,迁移学习在训练数据较少的情况下获得了出色的预测器性能,从而有效地节省了数据。在此基础上,提出了一种改进的遗传算法来优化电磁干扰,与DRL方法相比,该算法可以快速找到更好的解。因此,本文提出了一种详细的预测和优化探针图EMI的指导方针,并且所提出的方法可以进一步发展为有前途的智能系统级封装设计。
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EMI Prediction and Optimization for Pinmap Design Using Deep Transfer Learning and an Enhanced Genetic Algorithm
With the rapid increase in the operating frequency and integration density of ball grid array packages, pin assignment (pinmap) significantly impacts electromagnetic interference (EMI). However, the previous deep reinforcement learning (DRL) approaches required time-consuming evaluation and training procedures. In this article, we propose a novel design methodology for predicting and optimizing the EMI of pinmaps. First, we present a deep learning-based predictor that can accurately and quickly evaluate the EMI levels of pinmaps, thereby supporting fast pinmap design. Furthermore, transfer learning achieves excellent predictor performance with less training data, resulting in effective data savings. Based on the presented predictors, an enhanced genetic algorithm is developed to optimize the EMI and can quickly find better solutions compared with the DRL approaches. As a result, this article proposes a detailed guideline for predicting and optimizing the EMI of pinmaps, and the proposed methodology can be further developed for promising intelligent system-level packaging design.
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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