{"title":"编辑的话","authors":"","doi":"10.1109/MEI.2024.10721382","DOIUrl":null,"url":null,"abstract":"It is hard to believe that the end of the year is nearly upon us. This year has been filled with several great DEIS events and conferences, including EIC, ICD, and CEIDP. Each event has allowed members to meet in person and, in some cases, to see their long-time friends. In other cases, members had an opportunity to meet new colleagues and bright young minds that will hopefully become new friends. These events are always a sharing of knowledge and experience coupled with social networking.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 6","pages":"5-5"},"PeriodicalIF":2.6000,"publicationDate":"2024-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10721382","citationCount":"0","resultStr":"{\"title\":\"From the Editor\",\"authors\":\"\",\"doi\":\"10.1109/MEI.2024.10721382\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It is hard to believe that the end of the year is nearly upon us. This year has been filled with several great DEIS events and conferences, including EIC, ICD, and CEIDP. Each event has allowed members to meet in person and, in some cases, to see their long-time friends. In other cases, members had an opportunity to meet new colleagues and bright young minds that will hopefully become new friends. These events are always a sharing of knowledge and experience coupled with social networking.\",\"PeriodicalId\":444,\"journal\":{\"name\":\"IEEE Electrical Insulation Magazine\",\"volume\":\"40 6\",\"pages\":\"5-5\"},\"PeriodicalIF\":2.6000,\"publicationDate\":\"2024-10-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10721382\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Electrical Insulation Magazine\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10721382/\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electrical Insulation Magazine","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10721382/","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
It is hard to believe that the end of the year is nearly upon us. This year has been filled with several great DEIS events and conferences, including EIC, ICD, and CEIDP. Each event has allowed members to meet in person and, in some cases, to see their long-time friends. In other cases, members had an opportunity to meet new colleagues and bright young minds that will hopefully become new friends. These events are always a sharing of knowledge and experience coupled with social networking.
期刊介绍：
The EI Magazine publishes articles written by authors from industry, research institutes and academia. The articles are more practical in content than the papers published in the Transactions. Usually three articles are published in each issue. The articles deal with dielectric materials, processes and new developments applied to industry products. Also the EI Magazine is used to promote upcoming conferences and solicits papers for the conferences. In addition, reports on past conferences are given in many issues. Book reviews and news items are included. An editorial is written by both the EIC and the President of DEIS in alternate issues. Advertising of insulation products appears in many issues.
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