裂殖酵母 CK1 的 DNA 损伤修复功能涉及靶向 INO80 染色质重塑复合物的一个亚基 Arp8。

IF 4.3 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC ACS Applied Electronic Materials Pub Date : 2024-10-10 DOI:10.1080/10985549.2024.2408016
Sierra N Cullati, Kazutoshi Akizuki, Yufan Shan, Eric Zhang, Liping Ren, Rodrigo X Guillen, Lesley A Turner, Jun-Song Chen, Jose Navarrete-Perea, Zachary C Elmore, Steven P Gygi, Kathleen L Gould
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引用次数: 0

摘要

CK1 家族是保守的丝氨酸/苏氨酸激酶,具有多种底物和细胞功能。裂殖酵母 CK1 的直向同源物 Hhp1 和 Hhp2 首先被鉴定为 DNA 修复的调节因子,但 CK1 活性促进 DNA 修复的机制尚未得到研究。在这里,我们发现在酵母或人类细胞中删除 Hhp1 和 Hhp2 或抑制 CK1 催化活性会增加双链断裂(DSB)。在缺乏Hhp1和Hhp2活性的细胞中,修复DSB的主要途径--同源重组和非同源末端连接的效率都较低。为了了解Hhp1和Hhp2如何促进DNA损伤修复,我们利用定量磷酸蛋白组学鉴定了这些酶的新底物。我们证实,INO80染色质重塑复合物的一个成分Arp8是Hhp1和Hhp2的真正底物,对DNA修复非常重要。我们的数据表明,Hhp1和Hhp2通过磷酸化包括Arp8在内的多种底物来促进DNA修复。
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The DNA Damage Repair Function of Fission Yeast CK1 Involves Targeting Arp8, a Subunit of the INO80 Chromatin Remodeling Complex.

The CK1 family are conserved serine/threonine kinases with numerous substrates and cellular functions. The fission yeast CK1 orthologues Hhp1 and Hhp2 were first characterized as regulators of DNA repair, but the mechanism(s) by which CK1 activity promotes DNA repair had not been investigated. Here, we found that deleting Hhp1 and Hhp2 or inhibiting CK1 catalytic activities in yeast or in human cells increased double-strand breaks (DSBs). The primary pathways to repair DSBs, homologous recombination and nonhomologous end joining, were both less efficient in cells lacking Hhp1 and Hhp2 activity. To understand how Hhp1 and Hhp2 promote DNA damage repair, we identified new substrates of these enzymes using quantitative phosphoproteomics. We confirmed that Arp8, a component of the INO80 chromatin remodeling complex, is a bona fide substrate of Hhp1 and Hhp2 important for DNA repair. Our data suggest that Hhp1 and Hhp2 facilitate DNA repair by phosphorylating multiple substrates, including Arp8.

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CiteScore
7.20
自引率
4.30%
发文量
567
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