Christian Gaida, Tobias Heuermann, Sven Breitkopf, Tino Eidam, Jens Limpert
{"title":"用于硅加工的工业级 2 微米超快光纤激光器 CPA","authors":"Christian Gaida, Tobias Heuermann, Sven Breitkopf, Tino Eidam, Jens Limpert","doi":"10.1002/phvs.202400036","DOIUrl":null,"url":null,"abstract":"<p>A novel compact laser utilizing thulium-based fiber chirped-pulse amplification (CPA) technology has been developed to enable essential tasks such as microwelding or the precision cutting of filaments with semiconductors such as silicon. At a central wavelength of 2 μm, the activeTwo-15 provides pulse energies exceeding 100 μJ and an average power output surpassing 15 W, and can be seamlessly integrated into systems for materials processing.</p>","PeriodicalId":101021,"journal":{"name":"PhotonicsViews","volume":"21 5","pages":"44-47"},"PeriodicalIF":0.0000,"publicationDate":"2024-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/phvs.202400036","citationCount":"0","resultStr":"{\"title\":\"Industrial-grade 2-μm ultrafast fiber laser CPA for silicon processing\",\"authors\":\"Christian Gaida, Tobias Heuermann, Sven Breitkopf, Tino Eidam, Jens Limpert\",\"doi\":\"10.1002/phvs.202400036\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>A novel compact laser utilizing thulium-based fiber chirped-pulse amplification (CPA) technology has been developed to enable essential tasks such as microwelding or the precision cutting of filaments with semiconductors such as silicon. At a central wavelength of 2 μm, the activeTwo-15 provides pulse energies exceeding 100 μJ and an average power output surpassing 15 W, and can be seamlessly integrated into systems for materials processing.</p>\",\"PeriodicalId\":101021,\"journal\":{\"name\":\"PhotonicsViews\",\"volume\":\"21 5\",\"pages\":\"44-47\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-11-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://onlinelibrary.wiley.com/doi/epdf/10.1002/phvs.202400036\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"PhotonicsViews\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://onlinelibrary.wiley.com/doi/10.1002/phvs.202400036\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"PhotonicsViews","FirstCategoryId":"1085","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/phvs.202400036","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Industrial-grade 2-μm ultrafast fiber laser CPA for silicon processing
A novel compact laser utilizing thulium-based fiber chirped-pulse amplification (CPA) technology has been developed to enable essential tasks such as microwelding or the precision cutting of filaments with semiconductors such as silicon. At a central wavelength of 2 μm, the activeTwo-15 provides pulse energies exceeding 100 μJ and an average power output surpassing 15 W, and can be seamlessly integrated into systems for materials processing.
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