压电半导体层的压痕响应特性

IF 7.1 1区 工程技术 Q1 ENGINEERING, MECHANICAL International Journal of Mechanical Sciences Pub Date : 2024-11-16 DOI:10.1016/j.ijmecsci.2024.109809
Shijing Gao , Chengjian Ju , Guoquan Nie , Jinxi Liu , Weiqiu Chen
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引用次数: 0

摘要

压电半导体(PSCs)中压电性与半导体特性的相互作用可用于实现弹性波的放大和增益,以及调整电子特性。这不仅使压电半导体在多功能电子器件中具有巨大潜力,同时也提出了许多需要研究的多场耦合问题。本文考虑了 PSC 层的轴对称无摩擦压痕响应,该层与刚性基底完美粘合,并受到刚性球形压头的作用。在假设压头和刚性基底均为电绝缘的同时,充分考虑了 PSC 层的压电性和半导体特性的相互作用。通过汉克尔积分变换,压痕问题被简化为弗里德霍尔姆第二类积分方程,并对其进行数值求解。针对 PSC ZnO 层,给出了压痕力、电动势和接触半径的数值结果,系统地探讨了层厚、压头尺寸和半导体特性对 PSC 层在压痕作用下响应的影响。研究发现,可以忽略厚度效应的临界厚度取决于压痕深度。半导体特性对压痕响应的影响范围与 PSC 层的厚度有关。此外,有限元模拟验证了基于奇异积分方程法的理论结果。这项研究有助于更好地理解 PSC 材料的压电性与半导体特性之间的相互作用,对于开发压痕技术以提取 PSC 材料的耦合特性具有潜在价值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Indentation response characteristics of a piezoelectric semiconductor layer
The interaction of piezoelectricity with semiconducting property in piezoelectric semiconductors (PSCs) can be utilized to realize the amplification and gain of elastic waves and to tune the electronic property. This not only makes PSCs have enormous potential in multifunctional electronic devices, but also raises many multi-field coupled problems that need to be investigated. This paper considers the axisymmetric frictionless indentation responses of a PSC layer, which is perfectly bonded to a rigid substrate and acted on by a rigid spherical indenter. While both the indenter and the rigid substrate are assumed to be electrically insulating, the interaction of piezoelectricity and semiconducting property of a PSC layer is fully taken into consideration. By the Hankel integral transformation, the indentation problem is reduced to a Fredholm integral equation of the second kind, which is solved numerically. For the PSC ZnO layer, the numerical results for the indentation force, electric potential and contact radius are presented to systemically explore the effect of the layer thickness, indenter size and semiconducting property on the response of the PSC layer under indentation. It is found that the critical thickness, at which the thickness effect may be neglected, is dependent on the indentation depth. The influence range of semiconducting property on indentation response is related to the thickness of the PSC layer. Furthermore, the theoretical results based on the singular integral equation method are verified by the finite element simulation. This study is useful for a better understanding of the interaction between piezoelectricity and semiconducting property of PSC materials, which has potential value for developing indentation techniques to extract the coupling characteristics of PSC materials.
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来源期刊
International Journal of Mechanical Sciences
International Journal of Mechanical Sciences 工程技术-工程:机械
CiteScore
12.80
自引率
17.80%
发文量
769
审稿时长
19 days
期刊介绍: The International Journal of Mechanical Sciences (IJMS) serves as a global platform for the publication and dissemination of original research that contributes to a deeper scientific understanding of the fundamental disciplines within mechanical, civil, and material engineering. The primary focus of IJMS is to showcase innovative and ground-breaking work that utilizes analytical and computational modeling techniques, such as Finite Element Method (FEM), Boundary Element Method (BEM), and mesh-free methods, among others. These modeling methods are applied to diverse fields including rigid-body mechanics (e.g., dynamics, vibration, stability), structural mechanics, metal forming, advanced materials (e.g., metals, composites, cellular, smart) behavior and applications, impact mechanics, strain localization, and other nonlinear effects (e.g., large deflections, plasticity, fracture). Additionally, IJMS covers the realms of fluid mechanics (both external and internal flows), tribology, thermodynamics, and materials processing. These subjects collectively form the core of the journal's content. In summary, IJMS provides a prestigious platform for researchers to present their original contributions, shedding light on analytical and computational modeling methods in various areas of mechanical engineering, as well as exploring the behavior and application of advanced materials, fluid mechanics, thermodynamics, and materials processing.
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