Yang Liu , Weixin Li , Shudong Lin , Hui Liu , Zicheng Xie , Wanyan Li , Jiwen Hu , Xuefeng Gui
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Study on the factors influencing the thermal runaway hazards of styrene-acrylonitrile bulk copolymerization
The styrene-acrylonitrile bulk copolymerization reaction has a high risk of thermal runaway, but the factors influencing the thermal hazards of the reaction have not been adequately investigated. In this paper, the effects of different factors on the thermal runaway behavior of the styrene-acrylonitrile copolymerization are investigated using a combination of simulation and calorimetric testing. The simulation results indicate that increasing the proportion of styrene in the monomer feed significantly delays the onset of thermal runaway. The calorimetric results show that for di-tert-butyl peroxide (DTBP), azodiisobutyronitrile (AIBN) and tert-butyl peroxy benzoate (TBPB) initiators as examples, the TBPB-initiated copolymerization is found to have the maximum temperature-rising rate and pressure-rising rate. Under adiabatic runaway, the temperature and pressure change significantly with increasing TBPB concentration, indicating a great potential risk of thermal runaway. Calculation of kinetic parameters based on calorimetric data reveals thermal runaway mechanism.
期刊介绍：
Thermochimica Acta publishes original research contributions covering all aspects of thermoanalytical and calorimetric methods and their application to experimental chemistry, physics, biology and engineering. The journal aims to span the whole range from fundamental research to practical application.
The journal focuses on the research that advances physical and analytical science of thermal phenomena. Therefore, the manuscripts are expected to provide important insights into the thermal phenomena studied or to propose significant improvements of analytical or computational techniques employed in thermal studies. Manuscripts that report the results of routine thermal measurements are not suitable for publication in Thermochimica Acta.
The journal particularly welcomes papers from newly emerging areas as well as from the traditional strength areas:
- New and improved instrumentation and methods
- Thermal properties and behavior of materials
- Kinetics of thermally stimulated processes
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