社论:人工智能、机器学习和深度学习特刊导论:EMC的进展和应用

IF 2 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-19 DOI:10.1109/TEMC.2024.3504693
Alistair Duffy;En-Xiao Liu
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引用次数: 0

摘要

没有多少技术能像人工智能(AI)那样广泛而突然地抓住公众的想象力。虽然几十年来,人工智能一直是科幻小说的主要内容,在工程和科学领域也有多年的实际应用,但直到去年左右,生成式人工智能工具才吸引了这么多人的热情和参与。突然间,我们的普遍意识认为人工智能是如此容易接近和标准化。尤其明显的是,您希望对在线可用的AI工具进行简单的网络搜索,或者查看您最喜欢的编程语言的库和工具箱。
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Editorial: Introduction to the Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC
Not many technologies have ever captured the public imagination as widely and abruptly as artificial intelligence (AI). While AI has been a staple of science fiction for decades with actual applications in engineering and sciences for many years, it is only in the last year or so that generative AI tools have enthused and engaged so many people. All of a sudden, our general consciousness sees AI as so accessible and so normalized. This is particularly evident that you wish to do a simple web search of AI tools available online or perhaps check out the libraries and toolboxes of your favorite programming languages.
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
期刊最新文献
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