{"title":"半球形谐振腔能量耗散机理及质量因数增强方法","authors":"Ning Wang, Zhennan Wei, Zeyuan Xu, Guoxing Yi, Lishan Yuan, Wenyue Zhao, Dongfang Zhao","doi":"10.1016/j.ijmecsci.2024.109912","DOIUrl":null,"url":null,"abstract":"The quality-factor of hemispherical resonators is one of the important factors affecting the precision and performance of hemispherical resonator gyroscopes (HRGs). This study investigates the generation mechanism of subsurface damage (SSD) cracks in hemispherical resonators and their impact on the quality-factor, proposing a chemical etching method to enhance the quality-factor. First, a grinding model of a rotating grinding wheel was established based on indentation fracture theory, which reveals the generation mechanism of SSD cracks. Since mechanical processing inevitably causes a damaged layer on the surface of the hemispherical resonator, the damaged layer is mainly composed of surface cracks and SSD cracks that the surface cracks penetrate the interior of the material. In the vibration process of the hemispherical resonator, the SSD cracks significantly reduce the quality-factor, thus affecting the performance of HRGs. Second, by analyzing the stress field at the tip of the SSD cracks, a frictional energy dissipation model of SSD cracks was constructed, which reveals the effect of the SSD cracks on the quality-factor. Subsequently, a method for enhancing the quality-factor through chemical etching was proposed. The quality-factor enhancement method examines the passivation mechanism of SSD cracks during chemical etching. This process effectively reduces the length of the SSD cracks and increases the spacing between crack interfaces. These changes minimize frictional energy dissipation, thereby improving the quality-factor of hemispherical resonators. Finally, the experimental results of chemical etching and vibration performance of hemispherical resonators show that the SSD cracks are significantly improved after chemical etching and the quality-factor is improved from 1 × 10<ce:sup loc=\"post\">5</ce:sup> to 2 × 10<ce:sup loc=\"post\">7</ce:sup>. The experimental results demonstrate the correctness of the energy dissipation mechanism affecting the quality-factor and the effectiveness of the quality-factor enhancement method.","PeriodicalId":56287,"journal":{"name":"International Journal of Mechanical Sciences","volume":"37 1","pages":""},"PeriodicalIF":7.1000,"publicationDate":"2024-12-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Energy dissipation mechanism and quality-factor enhancement method in hemispherical resonator\",\"authors\":\"Ning Wang, Zhennan Wei, Zeyuan Xu, Guoxing Yi, Lishan Yuan, Wenyue Zhao, Dongfang Zhao\",\"doi\":\"10.1016/j.ijmecsci.2024.109912\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The quality-factor of hemispherical resonators is one of the important factors affecting the precision and performance of hemispherical resonator gyroscopes (HRGs). This study investigates the generation mechanism of subsurface damage (SSD) cracks in hemispherical resonators and their impact on the quality-factor, proposing a chemical etching method to enhance the quality-factor. First, a grinding model of a rotating grinding wheel was established based on indentation fracture theory, which reveals the generation mechanism of SSD cracks. Since mechanical processing inevitably causes a damaged layer on the surface of the hemispherical resonator, the damaged layer is mainly composed of surface cracks and SSD cracks that the surface cracks penetrate the interior of the material. In the vibration process of the hemispherical resonator, the SSD cracks significantly reduce the quality-factor, thus affecting the performance of HRGs. Second, by analyzing the stress field at the tip of the SSD cracks, a frictional energy dissipation model of SSD cracks was constructed, which reveals the effect of the SSD cracks on the quality-factor. Subsequently, a method for enhancing the quality-factor through chemical etching was proposed. The quality-factor enhancement method examines the passivation mechanism of SSD cracks during chemical etching. This process effectively reduces the length of the SSD cracks and increases the spacing between crack interfaces. These changes minimize frictional energy dissipation, thereby improving the quality-factor of hemispherical resonators. Finally, the experimental results of chemical etching and vibration performance of hemispherical resonators show that the SSD cracks are significantly improved after chemical etching and the quality-factor is improved from 1 × 10<ce:sup loc=\\\"post\\\">5</ce:sup> to 2 × 10<ce:sup loc=\\\"post\\\">7</ce:sup>. The experimental results demonstrate the correctness of the energy dissipation mechanism affecting the quality-factor and the effectiveness of the quality-factor enhancement method.\",\"PeriodicalId\":56287,\"journal\":{\"name\":\"International Journal of Mechanical Sciences\",\"volume\":\"37 1\",\"pages\":\"\"},\"PeriodicalIF\":7.1000,\"publicationDate\":\"2024-12-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Mechanical Sciences\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1016/j.ijmecsci.2024.109912\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Mechanical Sciences","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1016/j.ijmecsci.2024.109912","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Energy dissipation mechanism and quality-factor enhancement method in hemispherical resonator
The quality-factor of hemispherical resonators is one of the important factors affecting the precision and performance of hemispherical resonator gyroscopes (HRGs). This study investigates the generation mechanism of subsurface damage (SSD) cracks in hemispherical resonators and their impact on the quality-factor, proposing a chemical etching method to enhance the quality-factor. First, a grinding model of a rotating grinding wheel was established based on indentation fracture theory, which reveals the generation mechanism of SSD cracks. Since mechanical processing inevitably causes a damaged layer on the surface of the hemispherical resonator, the damaged layer is mainly composed of surface cracks and SSD cracks that the surface cracks penetrate the interior of the material. In the vibration process of the hemispherical resonator, the SSD cracks significantly reduce the quality-factor, thus affecting the performance of HRGs. Second, by analyzing the stress field at the tip of the SSD cracks, a frictional energy dissipation model of SSD cracks was constructed, which reveals the effect of the SSD cracks on the quality-factor. Subsequently, a method for enhancing the quality-factor through chemical etching was proposed. The quality-factor enhancement method examines the passivation mechanism of SSD cracks during chemical etching. This process effectively reduces the length of the SSD cracks and increases the spacing between crack interfaces. These changes minimize frictional energy dissipation, thereby improving the quality-factor of hemispherical resonators. Finally, the experimental results of chemical etching and vibration performance of hemispherical resonators show that the SSD cracks are significantly improved after chemical etching and the quality-factor is improved from 1 × 105 to 2 × 107. The experimental results demonstrate the correctness of the energy dissipation mechanism affecting the quality-factor and the effectiveness of the quality-factor enhancement method.
期刊介绍：
The International Journal of Mechanical Sciences (IJMS) serves as a global platform for the publication and dissemination of original research that contributes to a deeper scientific understanding of the fundamental disciplines within mechanical, civil, and material engineering.
The primary focus of IJMS is to showcase innovative and ground-breaking work that utilizes analytical and computational modeling techniques, such as Finite Element Method (FEM), Boundary Element Method (BEM), and mesh-free methods, among others. These modeling methods are applied to diverse fields including rigid-body mechanics (e.g., dynamics, vibration, stability), structural mechanics, metal forming, advanced materials (e.g., metals, composites, cellular, smart) behavior and applications, impact mechanics, strain localization, and other nonlinear effects (e.g., large deflections, plasticity, fracture).
Additionally, IJMS covers the realms of fluid mechanics (both external and internal flows), tribology, thermodynamics, and materials processing. These subjects collectively form the core of the journal's content.
In summary, IJMS provides a prestigious platform for researchers to present their original contributions, shedding light on analytical and computational modeling methods in various areas of mechanical engineering, as well as exploring the behavior and application of advanced materials, fluid mechanics, thermodynamics, and materials processing.
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