片上系统通信外设的系统级测试方法

IF 3.6 2区 计算机科学 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IEEE Transactions on Computers Pub Date : 2024-11-18 DOI:10.1109/TC.2024.3500375
Francesco Angione;Paolo Bernardi;Nicola di Gruttola Giardino;Gabriele Filipponi;Claudia Bertani;Vincenzo Tancorre
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引用次数: 0

摘要

本文讨论了片上系统通信外设的功能系统级测试(SLT)。提出的方法是在分析基于扫描的结构测试的潜在缺陷的基础上提出的。然后,本文阐述了如何开发一个功能强大的SLT程序软件套件来解决这些问题。如果通信外设提供检测/校正功能,该方法建议设计一个硬件配套模块,将其添加到自动测试设备(ATE)中,通过故意破坏数据帧与SoC通信模块进行交互。在意法半导体(STMicroelectronics)生产的工业汽车SoC上获得了实验结果,重点是控制器局域网(CAN)通信外设,并显示了SLT套件补充结构测试的有效性。
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A System-Level Test Methodology for Communication Peripherals in System-on-Chips
This paper deals with functional System-Level Test (SLT) for System-on-Chips (SoCs) communication peripherals. The proposed methodology is based on analyzing the potential weaknesses of applied structural tests such as Scan-based. Then, the paper illustrates how to develop a functional SLT programs software suite to address such issues. In case the communication peripheral provides detection/correction features, the methodology proposes the design of a hardware companion module to be added to the Automatic Test Equipment (ATE) to interact with the SoC communication module by purposely corrupting data frames. Experimental results are obtained on an industrial, automotive SoC produced by STMicroelectronics focusing on the Controller Area Network (CAN) communication peripheral and showing the effectiveness of the SLT suite to complement structural tests.
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来源期刊
IEEE Transactions on Computers
IEEE Transactions on Computers 工程技术-工程:电子与电气
CiteScore
6.60
自引率
5.40%
发文量
199
审稿时长
6.0 months
期刊介绍: The IEEE Transactions on Computers is a monthly publication with a wide distribution to researchers, developers, technical managers, and educators in the computer field. It publishes papers on research in areas of current interest to the readers. These areas include, but are not limited to, the following: a) computer organizations and architectures; b) operating systems, software systems, and communication protocols; c) real-time systems and embedded systems; d) digital devices, computer components, and interconnection networks; e) specification, design, prototyping, and testing methods and tools; f) performance, fault tolerance, reliability, security, and testability; g) case studies and experimental and theoretical evaluations; and h) new and important applications and trends.
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