放电等离子烧结多晶α-SiC的高温变形与固结

IF 2.6 4区 材料科学 Q2 MATERIALS SCIENCE, CERAMICS International Journal of Applied Ceramic Technology Pub Date : 2025-02-02 Epub Date: 2024-10-22 DOI:10.1111/ijac.14967
Dmytro Demirskyi, Hossein Sepehri-Amin, Oleg O. Vasylkiv
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引用次数: 0

摘要

本研究的主要目的是研究火花等离子烧结制备的无添加剂α碳化硅陶瓷的固结和弯曲强度。利用设计的实验方法,优化温度和停留时间,以获得完全致密的碳化硅块体。对碳化硅的固结过程进行了类似于块状陶瓷蠕变的分析,确定了致密化过程的活化能为596±39 kJ/mol,应力指数n小于2。随着温度升高至2000℃,块状无添加剂碳化硅陶瓷的抗弯强度逐渐提高。2000℃时的抗弯强度受加载速率的影响,在2.5 mm/min下,抗弯强度最大可达2.08 GPa。为了解释这一现象,创建了变形机制图,表明扩散蠕变是SiC在2000°C下应变敏感性的最可能机制。透射电镜显示,在2000℃时,α-SiC晶粒内的孪晶密度显著增加,表明激活了一种以前未报道的自强化机制。
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High-temperature deformation and consolidation of polycrystalline α-SiC by spark plasma sintering

The main objective of this investigation is the consolidation and flexural strength of alpha silicon carbide ceramics produced without additives by spark plasma sintering. Using the design of the experiment method, we optimized temperature and dwell to achieve fully dense silicon carbide bulks. The consolidation process of silicon carbide was analyzed similarly to the creep of bulk ceramics, and it was determined that the activation energy for the densification process was 596 ± 39 kJ/mol, while the stress exponent n was below 2. Bulk additive-free silicon carbide ceramics gradually increased flexural strength as the temperature rose to 2000°C. The flexural strength at 2000°C was influenced by the loading rate, and under 2.5 mm/min, it reached a maximum of 2.08 GPa. To explain this phenomenon, a deformation mechanisms map was created, indicating that diffusion creep is the most probable mechanism for the strain sensitivity of SiC at 2000°C. Transmission electron microscopy indicated a substantial rise in twin density within the α-SiC grains at 2000°C, indicating the activation of a previously unreported self-reinforcing mechanism.

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来源期刊
International Journal of Applied Ceramic Technology
International Journal of Applied Ceramic Technology 工程技术-材料科学:硅酸盐
CiteScore
3.90
自引率
9.50%
发文量
280
审稿时长
4.5 months
期刊介绍: The International Journal of Applied Ceramic Technology publishes cutting edge applied research and development work focused on commercialization of engineered ceramics, products and processes. The publication also explores the barriers to commercialization, design and testing, environmental health issues, international standardization activities, databases, and cost models. Designed to get high quality information to end-users quickly, the peer process is led by an editorial board of experts from industry, government, and universities. Each issue focuses on a high-interest, high-impact topic plus includes a range of papers detailing applications of ceramics. Papers on all aspects of applied ceramics are welcome including those in the following areas: Nanotechnology applications; Ceramic Armor; Ceramic and Technology for Energy Applications (e.g., Fuel Cells, Batteries, Solar, Thermoelectric, and HT Superconductors); Ceramic Matrix Composites; Functional Materials; Thermal and Environmental Barrier Coatings; Bioceramic Applications; Green Manufacturing; Ceramic Processing; Glass Technology; Fiber optics; Ceramics in Environmental Applications; Ceramics in Electronic, Photonic and Magnetic Applications;
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