选择性激光熔化钛合金的磁场辅助微铣削

IF 6.8 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Journal of Manufacturing Processes Pub Date : 2025-01-31 Epub Date: 2025-01-04 DOI:10.1016/j.jmapro.2024.12.069
Muhammad Rehan , Danish Tahir , Ping Guo , Wai Sze Yip , Sandy Suet To
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引用次数: 0

摘要

选择性激光熔化(SLM)是钛合金零件增材制造技术之一。在SLM之后,微铣削是获得良好表面质量的关键。本研究考察了磁场对SLM Ti6Al4V微铣削的影响,与现有理论一致,表明其优势。对比实验表明,当使用磁场时,平均表面粗糙度降低了22%。研究还探讨了磁场辅助微铣削过程中表面粗糙度的横向分布。扫描电镜图像证实较少的表面缺陷,如焊接芯片,材料侧流,深进料痕迹和微粒。此外,磁场的应用显著减少了刀具的磨损,包括堆积边缘(BUE)、微切屑和粘着磨损。这些发现为在增材制造零件的微铣削中使用磁场提供了有价值的见解。
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Magnetic field assisted micro-milling of selective laser melted titanium alloy
Selective Laser Melting (SLM) is one of the additive manufacturing technologies for producing titanium alloy parts. Following SLM, micro-milling is critical to achieving good surface quality of the fabricated part. This study examines the impact of a magnetic field on the micro-milling of SLM Ti6Al4V, aligning with existing theories that suggest its advantages. Comparative experiments demonstrate a 22 % reduction in average surface roughness when using a magnetic field. The study also explores the transverse distribution of surface roughness in magnetic field-assisted micro-milling. SEM images confirm fewer surface defects, such as welded chips, material side flow, deep feed marks, and microparticles. Additionally, the application of a magnetic field significantly reduces tool wear, including built-up edge (BUE), micro-chipping, and adhesive wear. These findings offer valuable insights for employing magnetic fields in the micro-milling of additively manufactured parts.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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