{"title":"新型稀土复合磨料化学机械抛光钛合金原子表面","authors":"Huiguang Sun , Zhenyu Zhang , Zihang Xue , Hongxiu Zhou , Zaiming Geng , Chuanshi Cheng , Leilei Chen , Ye Tian","doi":"10.1016/j.jmapro.2024.12.036","DOIUrl":null,"url":null,"abstract":"<div><div>Titanium (Ti) alloy is a typical difficult-to-process material, rising a challenge to obtain atomic surface for chemical mechanical polishing (CMP). Furthermore, toxic and polluted slurries are usually applied to CMP, resulting in the potential threat to the environment. To solve these items, novel green CMP was developed for a Ti alloy, containing lanthanum‑cerium oxyfluoride, silica, citric acid, hydrogen peroxide, glycine and deionized water. After CMP, atomic surface with surface roughness Sa of 0.155 nm is achieved, at a measurement area of 50 × 50 μm<sup>2</sup>, and the material removal rate (MRR) is 20.16 μm/h. To the best of our knowledge, for an atomic surface, the surface roughness and MRR are both the best for a Ti alloy. CMP mechanisms are elucidated by electrochemical measurements, X-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy. Firstly, Ti alloy was oxidized by hydrogen peroxide, generating oxides of Ti and aluminum (Al). The oxides were dissolved by hydrogen ions derived from citric acid. Ti and Al ions were chelated with hydrogen peroxide and citric acid, respectively. Chelation formulas were suggested between Al ions and citric acid. Finally, the soft oxidized layer on the surface of Ti alloy was removed by abrasives and a polishing pad. The developed green CMP proposes new insights to achieve atomic surface on a Ti alloy with a high MRR, providing a novel method to polishing difficult-to-process material.</div></div>","PeriodicalId":16148,"journal":{"name":"Journal of Manufacturing Processes","volume":"134 ","pages":"Pages 79-89"},"PeriodicalIF":7.8000,"publicationDate":"2025-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Atomic surface of titanium alloy using novel chemical mechanical polishing with rare earth composite abrasives\",\"authors\":\"Huiguang Sun , Zhenyu Zhang , Zihang Xue , Hongxiu Zhou , Zaiming Geng , Chuanshi Cheng , Leilei Chen , Ye Tian\",\"doi\":\"10.1016/j.jmapro.2024.12.036\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Titanium (Ti) alloy is a typical difficult-to-process material, rising a challenge to obtain atomic surface for chemical mechanical polishing (CMP). Furthermore, toxic and polluted slurries are usually applied to CMP, resulting in the potential threat to the environment. To solve these items, novel green CMP was developed for a Ti alloy, containing lanthanum‑cerium oxyfluoride, silica, citric acid, hydrogen peroxide, glycine and deionized water. After CMP, atomic surface with surface roughness Sa of 0.155 nm is achieved, at a measurement area of 50 × 50 μm<sup>2</sup>, and the material removal rate (MRR) is 20.16 μm/h. To the best of our knowledge, for an atomic surface, the surface roughness and MRR are both the best for a Ti alloy. CMP mechanisms are elucidated by electrochemical measurements, X-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy. Firstly, Ti alloy was oxidized by hydrogen peroxide, generating oxides of Ti and aluminum (Al). The oxides were dissolved by hydrogen ions derived from citric acid. Ti and Al ions were chelated with hydrogen peroxide and citric acid, respectively. Chelation formulas were suggested between Al ions and citric acid. Finally, the soft oxidized layer on the surface of Ti alloy was removed by abrasives and a polishing pad. The developed green CMP proposes new insights to achieve atomic surface on a Ti alloy with a high MRR, providing a novel method to polishing difficult-to-process material.</div></div>\",\"PeriodicalId\":16148,\"journal\":{\"name\":\"Journal of Manufacturing Processes\",\"volume\":\"134 \",\"pages\":\"Pages 79-89\"},\"PeriodicalIF\":7.8000,\"publicationDate\":\"2025-01-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Manufacturing Processes\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1526612524013161\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"2024/12/21 0:00:00\",\"PubModel\":\"Epub\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MANUFACTURING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Processes","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1526612524013161","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2024/12/21 0:00:00","PubModel":"Epub","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
Atomic surface of titanium alloy using novel chemical mechanical polishing with rare earth composite abrasives
Titanium (Ti) alloy is a typical difficult-to-process material, rising a challenge to obtain atomic surface for chemical mechanical polishing (CMP). Furthermore, toxic and polluted slurries are usually applied to CMP, resulting in the potential threat to the environment. To solve these items, novel green CMP was developed for a Ti alloy, containing lanthanum‑cerium oxyfluoride, silica, citric acid, hydrogen peroxide, glycine and deionized water. After CMP, atomic surface with surface roughness Sa of 0.155 nm is achieved, at a measurement area of 50 × 50 μm2, and the material removal rate (MRR) is 20.16 μm/h. To the best of our knowledge, for an atomic surface, the surface roughness and MRR are both the best for a Ti alloy. CMP mechanisms are elucidated by electrochemical measurements, X-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy. Firstly, Ti alloy was oxidized by hydrogen peroxide, generating oxides of Ti and aluminum (Al). The oxides were dissolved by hydrogen ions derived from citric acid. Ti and Al ions were chelated with hydrogen peroxide and citric acid, respectively. Chelation formulas were suggested between Al ions and citric acid. Finally, the soft oxidized layer on the surface of Ti alloy was removed by abrasives and a polishing pad. The developed green CMP proposes new insights to achieve atomic surface on a Ti alloy with a high MRR, providing a novel method to polishing difficult-to-process material.
期刊介绍:
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.