广角扫描可接合天线阵列的设计

IF 4.8 2区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Antennas and Wireless Propagation Letters Pub Date : 2024-11-25 DOI:10.1109/LAWP.2024.3505937
Liangliang Zhao;Hailiang Zhu;Yujie Di;Huiling Zhao;Jinchao Mou;Chufeng Hu
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引用次数: 0

摘要

通常,天线阵列的尺寸在制造后是固定的,这限制了它们的辐射特性。由于紧耦合偶极子阵列(TCDA)中元素之间存在相互连接的特性,本文提出了一种具有可接合组件的新型模块化TCDA设计。h面寄生金属条有利于设计平面双极化TCDA,采用可拼接设计,阻抗带宽为9.4:1 [(1 ~ 9.4)GHz],有源电压驻波比(VSWR)小于3。此外,它可以在E/ h平面上进行高达80°的波束扫描。具体而言,TCDA的任意尺寸都可以在短时间内组装,并且所有单元都可以重复使用。据作者所知,在超宽和广角扫描TCDAs中首次引入了可接合设计的概念。
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Design of Joinable Antenna Array With Wide-Angle Scanning
Generally, thedimension of the antenna arrays is fixed after manufacturing, limiting their radiation characteristics. Due to the existence of interconnected characteristics between elements in a tightly coupled dipole array (TCDA), this letter proposes a novel modular TCDA design with joinable components. The parasitic metal strip in the H-plane facilitates the deigned planar dual-polarized TCDA, which employs the joinable design to achieve an impedance bandwidth of 9.4:1 [(1 to 9.4) GHz], with an active voltage standing wave ratio (VSWR) of less than 3. Additionally, it enables beam scanning up to 80° in E/H-plane. Specifically, an arbitrary dimension of TCDA can be assembled in a short time and all units can be reused. To the best of the authors’ knowledge, the concept of joinable design introduced in ultrawide and wide-angle scanning TCDAs is presented for the first time.
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来源期刊
CiteScore
8.00
自引率
9.50%
发文量
529
审稿时长
1.0 months
期刊介绍: IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.
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