基于栅极包围半导体柱结构的电容式突触器及倒转电荷注入

IF 6.1 Q1 AUTOMATION & CONTROL SYSTEMS Advanced intelligent systems (Weinheim an der Bergstrasse, Germany) Pub Date : 2024-08-22 DOI:10.1002/aisy.202400371
Choong-Ki Kim, James Read, Minji Shon, Tae-Hyeon Kim, Myung-Su Kim, Ji-Man Yu, Min-Soo Yoo, Yang-Kyu Choi, Shimeng Yu
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引用次数: 0

摘要

这项工作中新提出的突触电容器(synaptor)具有交叉点特性,可以在4F2的特征尺寸上实现。该突触具有门环半导体柱(GSSP)结构,并具有翻转电荷注入(OCI)方案,以确保高电容性记忆窗口。利用Sentaurus TCAD仿真工具对工艺可行性和器件特性进行了论证。优化了两个重要的工艺参数,以显示最佳的特性;重叠高度(Hov)和槽柱高度(Hch)。OCI-GSSP设备的纵横比为10,最小重叠高度在40 nm的世界线和BL间距中显示出超过5的最高Con/Coff。这是目前报道的电容性突触中数值最高、单位器件尺寸最小的。通过子阵列电路仿真,阐述了OCI-GSSP器件的优势。由OCI-GSSP突触子阵列组成的子阵列可以计算一次能量为200 fJ、列延迟为3 ns的矢量矩阵乘法运算,并获得275 mV的足够信号裕度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Capacitive Synaptor with Gate Surrounding Semiconductor Pillar Structure and Overturned Charge Injection for Compute-in-Memory

The newly suggested synapse capacitor (synaptor) in this work has a cross-point feature, enabling implementation at a feature size of 4F2. This synaptor has a gate surrounding semiconductor pillar (GSSP) structure with overturned charge injection (OCI) scheme to ensure high capacitive memory window. Sentaurus TCAD simulation tools are used to demonstrate the process feasibility and device characteristics. Two important process parameters are optimized to show the best characteristics; overlap height (Hov) and channel pillar height (Hch). An OCI-GSSP device that has an aspect ratio of 10 and the minimal overlap height shows the highest Con/Coff over 5 in 40 nm wordline and BL pitch. It is the highest value and the smallest unit device size among the capacitive synapses that have been reported up to now. Advantages of scaled OCI-GSSP devices are appealed through subarray circuit simulation. The subarray composed of OCI-GSSP synaptor can calculate one vector-matrix multiplication operation with energy under 200 fJ and column delay of 3 ns, and result in sufficient signal margin of 275 mV.

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