用于改善硅表面钝化的三元cu掺杂ZnO-GO薄膜的界面处理见解

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-02-21 DOI:10.1007/s10854-025-14434-6
Amel Haouas, Ahlem Boussaid, Moez Salem, Abdullah Almohammedi, Hajar Ghannam
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引用次数: 0

摘要

采用水热法合成了含铜(Cu)-氧化锌(ZnO)-氧化石墨烯(GO)纳米结构,并在硅(Si)衬底上进行了自旋涂覆。利用x射线衍射(XRD)和原子力显微镜(AFM)进行结构分析,证实了氧化石墨烯薄片上成功形成了结晶良好的ZnO纳米颗粒,原子力显微镜显示,随着Cu掺入浓度的增加,晶粒尺寸减小,表面更光滑、更均匀。光学研究表明,2 at的带隙减小到3.241 eV。% cu处理薄膜,与纯ZnO相比。同时,光致发光(PL)发射强度随Cu浓度的增加而降低。此外,光学反射率测量显示,随着Cu掺入量的增加,反射率逐渐降低,表明光吸收改善。掺入Si和cu的ZnO-GO /Si样品的载流子寿命显著增加,其中2% cu掺杂样品的载流子寿命达到165 μs。这些结果表明,在ZnO-GO中掺入Cu通过减少重组位点和增强光吸收来改善表面钝化,使其成为硅基器件,特别是光伏应用中有前途的材料。
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Interfacial treatment insights of promising ternary Cu-doped ZnO–GO thin films for improved silicon surface passivation

Copper (Cu)-incorporated (0 to 2 at.%) Zinc oxide (ZnO)-Graphene oxide (GO) nanostructures were synthesized via a hydrothermal technique and spin-coated on silicon (Si) substrates. Structural analysis using X-ray diffraction (XRD) and atomic force microscopy (AFM) confirmed the successful formation of well-crystallized ZnO nanoparticles on GO sheets, with AFM revealing a decrease in grain size as the Cu incorporation concentration increased, resulting in smoother and more homogeneous surfaces. Optical studies revealed a reduction in the bandgap to 3.241 eV for 2 at.% Cu-treated films, compared to pure ZnO. Alongside this, photoluminescence (PL) emission intensity decreased as the Cu concentration increased. Furthermore, optical reflectance measurements showed a gradual decrease in reflectance with increasing Cu incorporation, indicating improved light absorption. The carrier lifetime of the Si and Cu-incorporated ZnO–GO/Si samples significantly increased, with the 2% Cu-doped sample reaching 165 μs. These results highlight that Cu incorporation in ZnO–GO improves surface passivation by reducing recombination sites and enhancing light absorption, making it a promising material for silicon-based devices, particularly in photovoltaic applications.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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