Amel Haouas, Ahlem Boussaid, Moez Salem, Abdullah Almohammedi, Hajar Ghannam
{"title":"用于改善硅表面钝化的三元cu掺杂ZnO-GO薄膜的界面处理见解","authors":"Amel Haouas, Ahlem Boussaid, Moez Salem, Abdullah Almohammedi, Hajar Ghannam","doi":"10.1007/s10854-025-14434-6","DOIUrl":null,"url":null,"abstract":"<div><p>Copper (Cu)-incorporated (0 to 2 at.%) Zinc oxide (ZnO)-Graphene oxide (GO) nanostructures were synthesized via a hydrothermal technique and spin-coated on silicon (Si) substrates. Structural analysis using X-ray diffraction (XRD) and atomic force microscopy (AFM) confirmed the successful formation of well-crystallized ZnO nanoparticles on GO sheets, with AFM revealing a decrease in grain size as the Cu incorporation concentration increased, resulting in smoother and more homogeneous surfaces. Optical studies revealed a reduction in the bandgap to 3.241 eV for 2 at.% Cu-treated films, compared to pure ZnO. Alongside this, photoluminescence (PL) emission intensity decreased as the Cu concentration increased. Furthermore, optical reflectance measurements showed a gradual decrease in reflectance with increasing Cu incorporation, indicating improved light absorption. The carrier lifetime of the Si and Cu-incorporated ZnO–GO/Si samples significantly increased, with the 2% Cu-doped sample reaching 165 μs. These results highlight that Cu incorporation in ZnO–GO improves surface passivation by reducing recombination sites and enhancing light absorption, making it a promising material for silicon-based devices, particularly in photovoltaic applications.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 6","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Interfacial treatment insights of promising ternary Cu-doped ZnO–GO thin films for improved silicon surface passivation\",\"authors\":\"Amel Haouas, Ahlem Boussaid, Moez Salem, Abdullah Almohammedi, Hajar Ghannam\",\"doi\":\"10.1007/s10854-025-14434-6\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Copper (Cu)-incorporated (0 to 2 at.%) Zinc oxide (ZnO)-Graphene oxide (GO) nanostructures were synthesized via a hydrothermal technique and spin-coated on silicon (Si) substrates. Structural analysis using X-ray diffraction (XRD) and atomic force microscopy (AFM) confirmed the successful formation of well-crystallized ZnO nanoparticles on GO sheets, with AFM revealing a decrease in grain size as the Cu incorporation concentration increased, resulting in smoother and more homogeneous surfaces. Optical studies revealed a reduction in the bandgap to 3.241 eV for 2 at.% Cu-treated films, compared to pure ZnO. Alongside this, photoluminescence (PL) emission intensity decreased as the Cu concentration increased. Furthermore, optical reflectance measurements showed a gradual decrease in reflectance with increasing Cu incorporation, indicating improved light absorption. The carrier lifetime of the Si and Cu-incorporated ZnO–GO/Si samples significantly increased, with the 2% Cu-doped sample reaching 165 μs. These results highlight that Cu incorporation in ZnO–GO improves surface passivation by reducing recombination sites and enhancing light absorption, making it a promising material for silicon-based devices, particularly in photovoltaic applications.</p></div>\",\"PeriodicalId\":646,\"journal\":{\"name\":\"Journal of Materials Science: Materials in Electronics\",\"volume\":\"36 6\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2025-02-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science: Materials in Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10854-025-14434-6\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14434-6","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Interfacial treatment insights of promising ternary Cu-doped ZnO–GO thin films for improved silicon surface passivation
Copper (Cu)-incorporated (0 to 2 at.%) Zinc oxide (ZnO)-Graphene oxide (GO) nanostructures were synthesized via a hydrothermal technique and spin-coated on silicon (Si) substrates. Structural analysis using X-ray diffraction (XRD) and atomic force microscopy (AFM) confirmed the successful formation of well-crystallized ZnO nanoparticles on GO sheets, with AFM revealing a decrease in grain size as the Cu incorporation concentration increased, resulting in smoother and more homogeneous surfaces. Optical studies revealed a reduction in the bandgap to 3.241 eV for 2 at.% Cu-treated films, compared to pure ZnO. Alongside this, photoluminescence (PL) emission intensity decreased as the Cu concentration increased. Furthermore, optical reflectance measurements showed a gradual decrease in reflectance with increasing Cu incorporation, indicating improved light absorption. The carrier lifetime of the Si and Cu-incorporated ZnO–GO/Si samples significantly increased, with the 2% Cu-doped sample reaching 165 μs. These results highlight that Cu incorporation in ZnO–GO improves surface passivation by reducing recombination sites and enhancing light absorption, making it a promising material for silicon-based devices, particularly in photovoltaic applications.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.