Tong Wu , Rui Xu , Hang Lu , Yuan Gao , Yongjun Li , Kun Fang , Fugang Lu , Ce Wang , Panpan Lin , Tiesong Lin , Peng He
{"title":"采用火花等离子烧结和热处理工艺设计高强低变形扩散焊5A06接头","authors":"Tong Wu , Rui Xu , Hang Lu , Yuan Gao , Yongjun Li , Kun Fang , Fugang Lu , Ce Wang , Panpan Lin , Tiesong Lin , Peng He","doi":"10.1016/j.jmapro.2025.02.076","DOIUrl":null,"url":null,"abstract":"<div><div>This study explores how to achieve high-strength and low-deformation rate diffusion-bonded joints. Herein, a 5A06 joint with 193 MPa tensile strength and 0.99 % deformation rate was successfully fabricated by spark plasma sintering diffusion bonding (SPSDB) and pulsed current. Meanwhile, the dynamic recrystallization (DRX) behavior in 5A06 during SPSDB was first systematically investigated by electron back-scattered diffraction (EBSD) and transmission electron microscopy (TEM). The results revealed that continuous DRX (CDRX) grains were formed near the bonding interface during SPSDB.</div></div>","PeriodicalId":16148,"journal":{"name":"Journal of Manufacturing Processes","volume":"141 ","pages":"Pages 93-104"},"PeriodicalIF":6.8000,"publicationDate":"2025-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Designing high-strength and low-deformation diffusion-bonded 5A06 joints via spark plasma sintering and heat treatment\",\"authors\":\"Tong Wu , Rui Xu , Hang Lu , Yuan Gao , Yongjun Li , Kun Fang , Fugang Lu , Ce Wang , Panpan Lin , Tiesong Lin , Peng He\",\"doi\":\"10.1016/j.jmapro.2025.02.076\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>This study explores how to achieve high-strength and low-deformation rate diffusion-bonded joints. Herein, a 5A06 joint with 193 MPa tensile strength and 0.99 % deformation rate was successfully fabricated by spark plasma sintering diffusion bonding (SPSDB) and pulsed current. Meanwhile, the dynamic recrystallization (DRX) behavior in 5A06 during SPSDB was first systematically investigated by electron back-scattered diffraction (EBSD) and transmission electron microscopy (TEM). The results revealed that continuous DRX (CDRX) grains were formed near the bonding interface during SPSDB.</div></div>\",\"PeriodicalId\":16148,\"journal\":{\"name\":\"Journal of Manufacturing Processes\",\"volume\":\"141 \",\"pages\":\"Pages 93-104\"},\"PeriodicalIF\":6.8000,\"publicationDate\":\"2025-05-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Manufacturing Processes\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1526612525002336\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"2025/2/28 0:00:00\",\"PubModel\":\"Epub\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MANUFACTURING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Processes","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1526612525002336","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2025/2/28 0:00:00","PubModel":"Epub","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
Designing high-strength and low-deformation diffusion-bonded 5A06 joints via spark plasma sintering and heat treatment
This study explores how to achieve high-strength and low-deformation rate diffusion-bonded joints. Herein, a 5A06 joint with 193 MPa tensile strength and 0.99 % deformation rate was successfully fabricated by spark plasma sintering diffusion bonding (SPSDB) and pulsed current. Meanwhile, the dynamic recrystallization (DRX) behavior in 5A06 during SPSDB was first systematically investigated by electron back-scattered diffraction (EBSD) and transmission electron microscopy (TEM). The results revealed that continuous DRX (CDRX) grains were formed near the bonding interface during SPSDB.
期刊介绍:
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.