hfo2基铁电层体阱特性对铁电场效应晶体管瞬态动力学的影响

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2025-02-19 DOI:10.1109/TED.2025.3539640
Hyoseok Kim;Ilho Myeong;Seunghyun Kim;Sungduk Hong;Sung Jin Kim;Wanki Kim;Daewon Ha;Dae Sin Kim
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引用次数: 0

摘要

在这项研究中,我们通过考虑陷阱动力学对器件特性的影响,研究了fet中的读后写延迟(RAWD)现象。首先,证实了用体阱解释RAWD现象的必要性。通过广泛的模拟,我们还建立了RAWD与总体陷阱属性(如陷阱水平和陷阱密度)之间的定量关系。结果表明,阱密度和阱能级对${V} _{t}$随延迟时间的变化有重要影响,进而影响器件的存储窗口(MW)。最后,我们提供了满足各种FeFET应用所需的MW和固有速度所需的hfo2基铁电材料的特性指南。
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Influence of Bulk Trap Properties in HfO₂-Based Ferroelectric Layers on the Transient Dynamics of Ferroelectric Field-Effect Transistors
In this study, we investigated the read-after-write-delay (RAWD) phenomenon in FeFETs by considering the influence of trap dynamics on the device characteristics. First of all, it was confirmed that it is necessary to interpret the RAWD phenomenon through bulk trap. Through extensive simulations, we also established a quantitative relationship between RAWD and bulk trap properties, such as trap level and trap density. The results indicate that both trap density and trap level play a significant role in determining the variation in ${V} _{t}$ with delay time, which in turn affects the memory window (MW) of the device. Finally, we provide guidelines on the characteristics of HfO2-based ferroelectric materials that are required to meet the MW and intrinsic speed required for various FeFET applications.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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