Bo Zhou , Ziyan Zhao , Bo Wang , Hui Zhang , Xuejian Liu , Zhengren Huang , Defeng Mo , Yan Liu
{"title":"pzt - 4j29 Kovar合金结合优化：金属化层厚度和等温时效时间对接头性能的影响","authors":"Bo Zhou , Ziyan Zhao , Bo Wang , Hui Zhang , Xuejian Liu , Zhengren Huang , Defeng Mo , Yan Liu","doi":"10.1016/j.jallcom.2025.180079","DOIUrl":null,"url":null,"abstract":"<div><div>The reliability of lead zirconate titanate (PZT) ceramics/4J29 Kovar alloy joints is essential for the performance of piezoelectric transducers during drilling operations. This study investigates the use of Sn-Ag-Cu solder as a substitute for organic adhesives to improve joint performance. A (Ti + Ni + Cu) metallization layer was applied to PZT ceramics to enhance solder wettability and facilitate the formation of a reliable joint. Stable joints are formed as Sn diffuses into the 4J29 Kovar alloy, creating a diffusion layer. Simultaneously, Sn, Cu, and Ni combine to form a homogeneous intermetallic compounds (IMCs) layer that effectively bonds the solder to the metallization. Optimal layer thicknesses of Ni (2000 nm) and Cu (150<!--> <!-->nm) yield a maximum joint strength of 33.0 ± 3.2<!--> <!-->MPa. The aging time significantly impacts IMCs thickness and joint strength; longer aging periods increase IMCs thickness while reducing joint strength. This research highlights the potential of Sn-Ag-Cu solder for joining metallized PZT ceramics and the 4J29 Kovar alloy, providing valuable insights for future developments in solder systems.</div></div>","PeriodicalId":344,"journal":{"name":"Journal of Alloys and Compounds","volume":"1023 ","pages":"Article 180079"},"PeriodicalIF":6.3000,"publicationDate":"2025-04-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Optimization of PZT-to-4J29 Kovar alloy bonding: Influence of metallization layer thickness and isothermal aging time on joint performance\",\"authors\":\"Bo Zhou , Ziyan Zhao , Bo Wang , Hui Zhang , Xuejian Liu , Zhengren Huang , Defeng Mo , Yan Liu\",\"doi\":\"10.1016/j.jallcom.2025.180079\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>The reliability of lead zirconate titanate (PZT) ceramics/4J29 Kovar alloy joints is essential for the performance of piezoelectric transducers during drilling operations. This study investigates the use of Sn-Ag-Cu solder as a substitute for organic adhesives to improve joint performance. A (Ti + Ni + Cu) metallization layer was applied to PZT ceramics to enhance solder wettability and facilitate the formation of a reliable joint. Stable joints are formed as Sn diffuses into the 4J29 Kovar alloy, creating a diffusion layer. Simultaneously, Sn, Cu, and Ni combine to form a homogeneous intermetallic compounds (IMCs) layer that effectively bonds the solder to the metallization. Optimal layer thicknesses of Ni (2000 nm) and Cu (150<!--> <!-->nm) yield a maximum joint strength of 33.0 ± 3.2<!--> <!-->MPa. The aging time significantly impacts IMCs thickness and joint strength; longer aging periods increase IMCs thickness while reducing joint strength. This research highlights the potential of Sn-Ag-Cu solder for joining metallized PZT ceramics and the 4J29 Kovar alloy, providing valuable insights for future developments in solder systems.</div></div>\",\"PeriodicalId\":344,\"journal\":{\"name\":\"Journal of Alloys and Compounds\",\"volume\":\"1023 \",\"pages\":\"Article 180079\"},\"PeriodicalIF\":6.3000,\"publicationDate\":\"2025-04-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Alloys and Compounds\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0925838825016378\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"CHEMISTRY, PHYSICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Alloys and Compounds","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0925838825016378","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
Optimization of PZT-to-4J29 Kovar alloy bonding: Influence of metallization layer thickness and isothermal aging time on joint performance
The reliability of lead zirconate titanate (PZT) ceramics/4J29 Kovar alloy joints is essential for the performance of piezoelectric transducers during drilling operations. This study investigates the use of Sn-Ag-Cu solder as a substitute for organic adhesives to improve joint performance. A (Ti + Ni + Cu) metallization layer was applied to PZT ceramics to enhance solder wettability and facilitate the formation of a reliable joint. Stable joints are formed as Sn diffuses into the 4J29 Kovar alloy, creating a diffusion layer. Simultaneously, Sn, Cu, and Ni combine to form a homogeneous intermetallic compounds (IMCs) layer that effectively bonds the solder to the metallization. Optimal layer thicknesses of Ni (2000 nm) and Cu (150 nm) yield a maximum joint strength of 33.0 ± 3.2 MPa. The aging time significantly impacts IMCs thickness and joint strength; longer aging periods increase IMCs thickness while reducing joint strength. This research highlights the potential of Sn-Ag-Cu solder for joining metallized PZT ceramics and the 4J29 Kovar alloy, providing valuable insights for future developments in solder systems.
期刊介绍：
The Journal of Alloys and Compounds is intended to serve as an international medium for the publication of work on solid materials comprising compounds as well as alloys. Its great strength lies in the diversity of discipline which it encompasses, drawing together results from materials science, solid-state chemistry and physics.
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