用L16正交阵列优化PLA材料的挤压温度和填充密度

{"title":"用L16正交阵列优化PLA材料的挤压温度和填充密度","authors":"M. Sabil, D. Prabhakar","doi":"10.1080/14484846.2022.2073022","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":8584,"journal":{"name":"Australian Journal of Mechanical Engineering","volume":"61 1","pages":""},"PeriodicalIF":1.3000,"publicationDate":"2022-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Optimisation of Extrusion Temperature and Infill Density of PLA material by using L16 Orthogonal Array\",\"authors\":\"M. Sabil, D. Prabhakar\",\"doi\":\"10.1080/14484846.2022.2073022\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":8584,\"journal\":{\"name\":\"Australian Journal of Mechanical Engineering\",\"volume\":\"61 1\",\"pages\":\"\"},\"PeriodicalIF\":1.3000,\"publicationDate\":\"2022-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Australian Journal of Mechanical Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1080/14484846.2022.2073022\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Australian Journal of Mechanical Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/14484846.2022.2073022","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}