BIODEGRADATION OF SOLUTIONS FOR CHEMICAL NICKELATION

In this article, we examined the susceptibility of biodegradation of nickel-containing processing solutions and selected fungicidal products which meet the requirements. Technological solutions are characterized by such a priority parameter as the high deposition rate of the nickel coating were subject to biofouling by mycelial fungi, despite the presence of heavy metal ions in solutions. It is established that the development of mycelial fungi in solutions leads to their decomposition and deterioration of technological characteristics. The purpose of the study was to select the fungicide and its corresponding concentrations, which do not adversely affect the process rate and the quality of the coating. The following tasks were posed: investigation of the stability of various solutions for nickel plating to the action of microorganisms; identification of taxonomic affiliation of microorganisms that populate solutions; selection of fungicide, meeting the requirements for neutrality to the components of the solution, as there is no effect on the rate of the process. Based on the results of the experiment, the influence of microorganisms on the technological characteristics of solutions was determined. After the appearance and development of the colonies of mycelial fungi in time solutions, the pH changed to an alkaline region, the deposition rate of the Ni-P coating dropped. Copper sulfate, sodium tetraborate, lactic acid, chloroform was used as inhibitors. The use of copper sulfate fungicide in concentrations of 0.002-0.005 mol/l led to the inhibition of growth of the fungal colonies, but insignificant. Fungicide sodium tetraborate at a concentration of 0.03 mol/l had a noticeable inhibitory effect on the growth of fungi, and also had a positive effect on the rate of the process, which meets all the requirements for this compound. For citation: Mukhametova G.M., Vinokurov E.G., Babusenko E.S., Skopintsev V.D. Biodegradation of solutions for chemical nickelation. Izv. Vyssh. Uchebn. Zaved. Khim. Khim. Tekhnol. 2018. V. 61. N 9-10. P. 89-97