Determination of the full-field stress and displacement using photoelasticity and sampling moiré method in a 3D-printed model

The quantitative characterization of the full-field stress and displacement is significant for analyzing the failure and instability of engineering materials. Various optical measurement techniques such as photoelasticity, moiré and digital image correlation methods have been developed to achieve this goal. However, these methods are difficult to incorporate to determine the stress and displacement fields simultaneously because the tested models must contain particles and grating for displacement measurement; however, these elements will disturb the light passing through the tested models using photoelasticity. In this study, by combining photoelasticity and the sampling moiré method, we developed a method to determine the stress and displacement fields simultaneously in a three-dimensional (3D)-printed photoelastic model with orthogonal grating. Then, the full-field stress was determined by analyzing 10 photoelastic patterns, and the displacement fields were calculated using the sampling moiré method. The results indicate that the developed method can simultaneously determine the stress and displacement fields.