Zhiyuan Li, Shang‐lin Gao, R. Kang, Liang Honggang, Xiaoguang Guo
{"title":"研磨与磨削对硅片表面/亚表面损伤的影响及其抛光效率的对比研究","authors":"Zhiyuan Li, Shang‐lin Gao, R. Kang, Liang Honggang, Xiaoguang Guo","doi":"10.1504/ijat.2020.10032192","DOIUrl":null,"url":null,"abstract":"The lapping and grinding induced wafers surface damage layers with the same roughness Ra were compared in terms of surface morphology, surface roughness PV, subsurface damage, material removal mech...","PeriodicalId":39039,"journal":{"name":"International Journal of Abrasive Technology","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2020-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A comparative study of lapping and grinding induced surface/subsurface damage of silicon wafers and corresponding polishing efficiency\",\"authors\":\"Zhiyuan Li, Shang‐lin Gao, R. Kang, Liang Honggang, Xiaoguang Guo\",\"doi\":\"10.1504/ijat.2020.10032192\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The lapping and grinding induced wafers surface damage layers with the same roughness Ra were compared in terms of surface morphology, surface roughness PV, subsurface damage, material removal mech...\",\"PeriodicalId\":39039,\"journal\":{\"name\":\"International Journal of Abrasive Technology\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-09-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Abrasive Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1504/ijat.2020.10032192\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Abrasive Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1504/ijat.2020.10032192","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Engineering","Score":null,"Total":0}
A comparative study of lapping and grinding induced surface/subsurface damage of silicon wafers and corresponding polishing efficiency
The lapping and grinding induced wafers surface damage layers with the same roughness Ra were compared in terms of surface morphology, surface roughness PV, subsurface damage, material removal mech...
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
