用于大规模阵列的不等间距可伸缩双极化缝隙定位超宽带天线阵列

IF 0.6 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Electromagnetics Pub Date : 2022-05-19 DOI:10.1080/02726343.2022.2110015
Yuanjiang Zhu, Xiangxiang Li, Jing Tao, Weixiang Jiang
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引用次数: 2

摘要

摘要文章展示了一种可拼接的双pol。用于大规模阵列的超宽带阵列天线。基本天线元件采用不等间距金属弹结构,辐射渐变槽由金属弹辐射器拼接而成。子弹头结构通过弹性射频连接器直接垂直互连。天线结构可以独立安装在金属背板上,并通过金属背板上的插槽进行定位,以确保良好的电气性能。与PCB技术处理的天线结构相比,这种类型的天线可以有效地避免表面波模式的产生,从而确保宽带中不存在VSWR奇异性。所提出的天线阵列可以在四个倍频程内实现方位面±45°扫描和仰角面±35°扫描。基于所提出的天线,对10*10原型进行了测试。测量结果与模拟结果一致。
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Unequally Spaced Scalable dual-polarized Ultra-wideband Antenna Array with Slot Positioning for Large Scale Array
ABSTRACT article shows a splicable dual-pol. ultra-wideband array antenna used in large-scale arrays. An unequal-spaced metal bullet structure is used as the basic antenna element, and the gradual slot for radiation is spliced by the metal bullet radiator. The bullet structure is directly and vertically interconnected through elastic RF connectors. The antenna structure can be independently installed on the metal backplane and positioned through the slots on the metal backplane to ensure good electrical performance. Compared with the antenna structure processed by PCB technology, this type of antenna can effectively avoid the generation of surface wave modes, thereby ensuring that there is no VSWR singularity in the broadband. The proposed antenna array can realize ±45°scanning in azimuth plane and ±35°scanning in elevation plane within four octave bands. Based on the proposed antenna, a 10*10 prototype was tested. The measured results were consistent with the simulation results.
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来源期刊
Electromagnetics
Electromagnetics 工程技术-工程:电子与电气
CiteScore
1.60
自引率
12.50%
发文量
31
审稿时长
6 months
期刊介绍: Publishing eight times per year, Electromagnetics offers refereed papers that span the entire broad field of electromagnetics and serves as an exceptional reference source of permanent archival value. Included in this wide ranging scope of materials are developments in electromagnetic theory, high frequency techniques, antennas and randomes, arrays, numerical techniques, scattering and diffraction, materials, and printed circuits. The journal also serves as a forum for deliberations on innovations in the field. Additionally, special issues give more in-depth coverage to topics of immediate importance. All submitted manuscripts are subject to initial appraisal by the Editor, and, if found suitable for further consideration, to peer review by independent, anonymous expert referees. Submissions can be made via email or postal mail.
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