FGM层包裹矩形圆形夹杂物的建模与应力分析

Pushpa Rani, D. Verma, Gyander Ghangas
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引用次数: 0

摘要

本工作的目的是对功能梯度材料(FGM)层包裹的圆形矩形夹杂物周围的应力进行建模和分析。在受到远场拉应力的无限平板中考虑了夹杂物。采用扩展有限元方法(XFEM)对非共形网格的夹杂物进行了建模。利用圆形和矩形的水平集函数,用网格追踪夹杂物边界。FGM被认为是夹杂物和板材的连续变化混合物,具有沿夹杂物界面法线方向的幂律函数。假设杨氏模量在FGM层内变化,而泊松比保持不变。分析了不同几何参数和FGM参数下的应力分布和应力集中因子。研究表明,利用水平集方法的XFEM可以有效地对圆角矩形等形状复杂的夹杂物进行建模。应用FGM层使圆角矩形夹杂物周围的应力分布变得平滑,并显著降低SCF。最大应力的位置从夹杂物界面向FGM层界面移动。已经注意到最小SCF,幂律指数n=0.5并且FGM层厚度t=r。
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Modeling and Stress Analysis of Rounded Rectangular Inclusion Enclosed by FGM Layer
The aim of the present work is to model and analyze stresses around rounded rectangular inclusion enclosed with functionally graded material (FGM) layer. The inclusion has been considered in an infinite plate which is subjected to far-field tensile stress. The extended finite element method (XFEM) has been used to model the inclusion with non-conformal mesh. The level set functions of circular and rectangular shapes have been used to trace the inclusion boundary with mesh. The FGM has been considered as continuous varying mixture of inclusion and plate materials with power law function along normal direction to the inclusion interface. Young's modulus has been assumed to vary within FGM layer, whereas Poisson's ratio is kept constant. The stress distribution and stress concentration factor (SCF) have been analyzed for different geometrical and FGM parameters. It has been observed that XFEM with level set method efficiently model the difficult shape inclusions such as rounded rectangle. Applying the FGM layer smoothens the stress distribution around rounded rectangular inclusion and significantly reduces SCF. The position of maximum stress shifted from the inclusion interface toward the FGM layer interface. The least SCF has been noted with power law index n = 0.5 and FGM layer thickness t = r.
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来源期刊
CiteScore
3.80
自引率
6.20%
发文量
57
审稿时长
20 weeks
期刊介绍: IJMEMS is a peer reviewed international journal aiming on both the theoretical and practical aspects of mathematical, engineering and management sciences. The original, not-previously published, research manuscripts on topics such as the following (but not limited to) will be considered for publication: *Mathematical Sciences- applied mathematics and allied fields, operations research, mathematical statistics. *Engineering Sciences- computer science engineering, mechanical engineering, information technology engineering, civil engineering, aeronautical engineering, industrial engineering, systems engineering, reliability engineering, production engineering. *Management Sciences- engineering management, risk management, business models, supply chain management.
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