{"title":"液滴与超疏水表面的相互作用","authors":"P. M. Somvanshi, V. V. Cheverda, O. A. Kabov","doi":"10.1134/S1990478923020187","DOIUrl":null,"url":null,"abstract":"<p> The interaction of a liquid drop with a copper surface is studied. The substrate is assumed\nto be superhydrophobic with a wetting angle of\n<span>\\( 150^\\circ \\)</span>. Based on the volume of the drop, the Bond and Weber numbers are\napproximately 0.23 and 1.6, respectively. The temperature of the surface and the surrounding air\nis 298 K, and the temperature of the liquid drop is 5K lower. Simulation of conjugate heat\ntransfer is performed using an axisymmetric coordinate system. The Kistler contact line model is\nused to determine the dynamic contact angle of a drop during spreading. The change in the shear\nstress on the substrate and the heat flux induced during the propagation of the drop as a function\nof time is studied.\n</p>","PeriodicalId":607,"journal":{"name":"Journal of Applied and Industrial Mathematics","volume":"17 2","pages":"405 - 413"},"PeriodicalIF":0.5800,"publicationDate":"2023-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Interaction of a Liquid Drop with a Superhydrophobic Surface\",\"authors\":\"P. M. Somvanshi, V. V. Cheverda, O. A. Kabov\",\"doi\":\"10.1134/S1990478923020187\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p> The interaction of a liquid drop with a copper surface is studied. The substrate is assumed\\nto be superhydrophobic with a wetting angle of\\n<span>\\\\( 150^\\\\circ \\\\)</span>. Based on the volume of the drop, the Bond and Weber numbers are\\napproximately 0.23 and 1.6, respectively. The temperature of the surface and the surrounding air\\nis 298 K, and the temperature of the liquid drop is 5K lower. Simulation of conjugate heat\\ntransfer is performed using an axisymmetric coordinate system. The Kistler contact line model is\\nused to determine the dynamic contact angle of a drop during spreading. The change in the shear\\nstress on the substrate and the heat flux induced during the propagation of the drop as a function\\nof time is studied.\\n</p>\",\"PeriodicalId\":607,\"journal\":{\"name\":\"Journal of Applied and Industrial Mathematics\",\"volume\":\"17 2\",\"pages\":\"405 - 413\"},\"PeriodicalIF\":0.5800,\"publicationDate\":\"2023-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Applied and Industrial Mathematics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://link.springer.com/article/10.1134/S1990478923020187\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Applied and Industrial Mathematics","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.1134/S1990478923020187","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Engineering","Score":null,"Total":0}
Interaction of a Liquid Drop with a Superhydrophobic Surface
The interaction of a liquid drop with a copper surface is studied. The substrate is assumed
to be superhydrophobic with a wetting angle of
\( 150^\circ \). Based on the volume of the drop, the Bond and Weber numbers are
approximately 0.23 and 1.6, respectively. The temperature of the surface and the surrounding air
is 298 K, and the temperature of the liquid drop is 5K lower. Simulation of conjugate heat
transfer is performed using an axisymmetric coordinate system. The Kistler contact line model is
used to determine the dynamic contact angle of a drop during spreading. The change in the shear
stress on the substrate and the heat flux induced during the propagation of the drop as a function
of time is studied.
期刊介绍：
Journal of Applied and Industrial Mathematics is a journal that publishes original and review articles containing theoretical results and those of interest for applications in various branches of industry. The journal topics include the qualitative theory of differential equations in application to mechanics, physics, chemistry, biology, technical and natural processes; mathematical modeling in mechanics, physics, engineering, chemistry, biology, ecology, medicine, etc.; control theory; discrete optimization; discrete structures and extremum problems; combinatorics; control and reliability of discrete circuits; mathematical programming; mathematical models and methods for making optimal decisions; models of theory of scheduling, location and replacement of equipment; modeling the control processes; development and analysis of algorithms; synthesis and complexity of control systems; automata theory; graph theory; game theory and its applications; coding theory; scheduling theory; and theory of circuits.
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