{"title":"射频溅射六方氮化硼薄膜基印刷电路板用于高压和大功率电子应用","authors":"K. Kumar, K. Kumar","doi":"10.1504/ijmpt.2021.10041991","DOIUrl":null,"url":null,"abstract":"The power electronic devices use big heat sinks for the removal of heat from the components. These heat sinks are bulk in size. Therefore, the strategy is to remove the heat sink from the PCB and i...","PeriodicalId":14167,"journal":{"name":"International Journal of Materials & Product Technology","volume":" ","pages":""},"PeriodicalIF":0.5000,"publicationDate":"2021-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"RF sputtered hexagonal boron nitride film-based printed circuit board for high voltage and high-power electronic applications\",\"authors\":\"K. Kumar, K. Kumar\",\"doi\":\"10.1504/ijmpt.2021.10041991\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The power electronic devices use big heat sinks for the removal of heat from the components. These heat sinks are bulk in size. Therefore, the strategy is to remove the heat sink from the PCB and i...\",\"PeriodicalId\":14167,\"journal\":{\"name\":\"International Journal of Materials & Product Technology\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":0.5000,\"publicationDate\":\"2021-10-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Materials & Product Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1504/ijmpt.2021.10041991\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Materials & Product Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1504/ijmpt.2021.10041991","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
RF sputtered hexagonal boron nitride film-based printed circuit board for high voltage and high-power electronic applications
The power electronic devices use big heat sinks for the removal of heat from the components. These heat sinks are bulk in size. Therefore, the strategy is to remove the heat sink from the PCB and i...
期刊介绍:
The IJMPT is a refereed and authoritative publication which provides a forum for the exchange of information and ideas between materials academics and engineers working in university research departments and research institutes, and manufacturing, marketing and process managers, designers, technologists and research and development engineers working in industry.